是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | SOIC | 包装说明: | SOP, SOP16,.4 |
针数: | 16 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.43 | Is Samacsys: | N |
模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER | JESD-30 代码: | R-PDSO-G16 |
JESD-609代码: | e3 | 长度: | 10.3 mm |
湿度敏感等级: | 3 | 信道数量: | 8 |
功能数量: | 1 | 端子数量: | 16 |
通态电阻匹配规范: | 240 Ω | 最大通态电阻 (Ron): | 1300 Ω |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP16,.4 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 260 |
电源: | 2/6 V | 认证状态: | Not Qualified |
座面最大高度: | 2.65 mm | 最大信号电流: | 0.025 A |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.04 mA |
最大供电电压 (Vsup): | 6 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
最长断开时间: | 200 ns | 最长接通时间: | 200 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 7.5 mm | Base Number Matches: | 1 |
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