是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, SOP16,.25 | 针数: | 16 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 0.41 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 225443 |
Samacsys Pin Count: | 16 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | SOIC-16 CASE751B-05 |
Samacsys Released Date: | 2015-08-11 08:53:22 | Is Samacsys: | N |
其他特性: | ALSO OPERATES WITH 2V TO 12V (VCC-VEE) SUPPLY | 模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码: | R-PDSO-G16 | JESD-609代码: | e3 |
长度: | 9.9 mm | 湿度敏感等级: | 1 |
负电源电压最大值(Vsup): | -6 V | 负电源电压最小值(Vsup): | |
标称负供电电压 (Vsup): | -4.5 V | 信道数量: | 4 |
功能数量: | 1 | 端子数量: | 16 |
标称断态隔离度: | 40 dB | 通态电阻匹配规范: | 18 Ω |
最大通态电阻 (Ron): | 170 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP16,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 电源: | 2/6,GND/-6 V |
认证状态: | Not Qualified | 座面最大高度: | 1.75 mm |
最大信号电流: | 0.025 A | 子类别: | Multiplexer or Switches |
最大供电电流 (Isup): | 0.08 mA | 最大供电电压 (Vsup): | 6 V |
最小供电电压 (Vsup): | 2 V | 标称供电电压 (Vsup): | 4.5 V |
表面贴装: | YES | 最长断开时间: | 76 ns |
最长接通时间: | 345 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3.9 mm |
Base Number Matches: | 1 |
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