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MC74HC1G08DFT1 PDF预览

MC74HC1G08DFT1

更新时间: 2024-10-30 23:05:47
品牌 Logo 应用领域
安森美 - ONSEMI 栅极逻辑集成电路光电二极管
页数 文件大小 规格书
8页 96K
描述
Single 2-Input AND Gate

MC74HC1G08DFT1 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:SOT-353包装说明:SC-70, SC-88A, SOT-353, 5 PIN
针数:5Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:7.51Is Samacsys:N
系列:HC/UHJESD-30 代码:R-PDSO-G5
JESD-609代码:e0长度:2 mm
负载电容(CL):50 pF逻辑集成电路类型:AND GATE
最大I(ol):0.002 A湿度敏感等级:1
功能数量:1输入次数:2
端子数量:5最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP5/6,.08
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):240
电源:2/6 VProp。Delay @ Nom-Sup:35 ns
传播延迟(tpd):155 ns认证状态:Not Qualified
施密特触发器:NO座面最大高度:1.1 mm
子类别:Gates最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:1.25 mmBase Number Matches:1

MC74HC1G08DFT1 数据手册

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MC74HC1G08  
Single 2-Input AND Gate  
The MC74HC1G08 is a high speed CMOS 2–input AND gate  
fabricated with silicon gate CMOS technology.  
The internal circuit is composed of multiple stages, including a  
buffer output which provides high noise immunity and stable output.  
The MC74HC1G08 output drive current is 1/2 compared to  
MC74HC series.  
http://onsemi.com  
High Speed: t = 7 ns (Typ) at V = 5 V  
PD  
CC  
Low Power Dissipation: I = 1 mA (Max) at T = 25°C  
CC  
A
MARKING  
High Noise Immunity  
Balanced Propagation Delays (tpLH = tpHL)  
DIAGRAMS  
5
1
H2d  
Symmetrical Output Impedance (I = I = 2 mA)  
OH  
OL  
SC70–5/SC–88A/SOT–353  
DF SUFFIX  
Chip Complexity: FET = 44  
CASE 419A  
Pin 1  
5
IN B  
IN A  
GND  
1
2
3
V
CC  
5
H2d  
1
SOT23–5/TSOP–5/SC59–5  
DT SUFFIX  
Pin 1  
CASE 483  
4
OUT Y  
d = Date Code  
Figure 1. Pinout  
PIN ASSIGNMENT  
1
2
3
4
5
IN B  
IN A  
IN A  
IN B  
&
GND  
OUT Y  
OUT Y  
V
CC  
Figure 2. Logic Symbol  
FUNCTION TABLE  
Inputs  
Output  
Y
A
B
L
L
L
H
L
L
L
H
H
L
H
H
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
September, 2001 – Rev. 7  
MC74HC1G08/D  

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