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MC74HC175ADR2G PDF预览

MC74HC175ADR2G

更新时间: 2024-11-02 05:22:15
品牌 Logo 应用领域
安森美 - ONSEMI 触发器锁存器逻辑集成电路光电二极管时钟
页数 文件大小 规格书
10页 121K
描述
Quad D Flip−Flop with Common Clock and Reset High−Performance Silicon−Gate CMOS

MC74HC175ADR2G 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:SOIC
包装说明:SOP, SOP16,.25针数:16
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:0.79Is Samacsys:N
系列:HC/UHJESD-30 代码:R-PDSO-G16
JESD-609代码:e3长度:9.9 mm
负载电容(CL):50 pF逻辑集成电路类型:D FLIP-FLOP
最大频率@ Nom-Sup:20000000 Hz最大I(ol):0.004 A
湿度敏感等级:1位数:1
功能数量:4端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
输出极性:COMPLEMENTARY封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP16,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
电源:2/6 V传播延迟(tpd):225 ns
认证状态:Not Qualified座面最大高度:1.75 mm
子类别:FF/Latches最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
触发器类型:POSITIVE EDGE宽度:3.9 mm
最小 fmax:24 MHzBase Number Matches:1

MC74HC175ADR2G 数据手册

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MC74HC175A  
Quad D Flip−Flop with  
Common Clock and Reset  
High−Performance Silicon−Gate CMOS  
The MC74HC175A is identical in pinout to the LS175. The device  
inputs are compatible with standard CMOS outputs; with pullup  
resistors, they are compatible with LSTTL outputs.  
This device consists of four D flip−flops with common Reset and  
Clock inputs, and separate D inputs. Reset (active−low) is  
asynchronous and occurs when a low level is applied to the Reset  
input. Information at a D input is transferred to the corresponding Q  
output on the next positive going edge of the Clock input.  
http://onsemi.com  
MARKING  
DIAGRAMS  
16  
PDIP−16  
N SUFFIX  
CASE 648  
MC74HC175AN  
AWLYYWW  
16  
1
Features  
1
Output Drive Capability: 10 LSTTL Loads  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2.0 to 6.0 V  
Low Input Current: 1 mA  
High Noise Immunity Characteristic of CMOS Devices  
In Compliance with the Requirements Defined by JEDEC Standard  
No. 7A  
16  
SOIC−16  
D SUFFIX  
CASE 751B  
HC175AG  
AWLYWW  
16  
1
1
16  
Chip Complexity 166 FETs or 41.5 Equivalent Gates  
Pb−Free Packages are Available*  
TSSOP−16  
DT SUFFIX  
CASE 948F  
HC  
175A  
ALYWG  
G
16  
1
1
16  
1
SOEIAJ−16  
F SUFFIX  
CASE 966  
16  
74HC175A  
ALYWG  
1
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
W, WW = Work Week  
G
= Pb−Free Package  
= Pb−Free Package  
G
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
June, 2005 − Rev. 3  
MC74HC175A/D  

MC74HC175ADR2G 替代型号

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MC74HC175ADG ONSEMI

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