是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | 针数: | 360 |
Reach Compliance Code: | not_compliant | ECCN代码: | 3A991.A.1 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.36 |
Is Samacsys: | N | 其他特性: | ALSO REQUIRES 1.8V OR 2.5V SUPPLY |
地址总线宽度: | 36 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 167 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-CBGA-B360 |
JESD-609代码: | e0 | 长度: | 25 mm |
低功率模式: | YES | 湿度敏感等级: | 1 |
端子数量: | 360 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | BGA | 封装等效代码: | BGA360,19X19,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 电源: | 1.3,1.8/2.5 V |
认证状态: | Not Qualified | 座面最大高度: | 3.24 mm |
速度: | 1167 MHz | 子类别: | Microprocessors |
最大供电电压: | 1.35 V | 最小供电电压: | 1.25 V |
标称供电电压: | 1.3 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MC7447AHX1267LB | NXP | RISC Microprocessor Hardware Specifications |
获取价格 |
|
MC7447AHX1333LB | NXP | RISC Microprocessor Hardware Specifications |
获取价格 |
|
MC7447AHX1420LB | NXP | APOLO7PM,RV1.1,1.3V,105C |
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|
MC7447AHX600NB | NXP | RISC Microprocessor Hardware Specifications |
获取价格 |
|
MC7447AHX733NB | NXP | RISC Microprocessor Hardware Specifications |
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|
MC7447AHX867NB | NXP | RISC Microprocessor Hardware Specifications |
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