是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
针数: | 360 | Reach Compliance Code: | not_compliant |
ECCN代码: | 3A001.A.3 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.39 | 地址总线宽度: | 36 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 133 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-CBGA-B360 | JESD-609代码: | e0 |
长度: | 25 mm | 低功率模式: | YES |
湿度敏感等级: | 1 | 端子数量: | 360 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装等效代码: | BGA360,19X19,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 220 |
电源: | 1.3,1.5/2.5,1.8/2.5 V | 认证状态: | Not Qualified |
座面最大高度: | 3.2 mm | 速度: | 733 MHz |
子类别: | Microprocessors | 最大供电电压: | 1.35 V |
最小供电电压: | 1.25 V | 标称供电电压: | 1.3 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 25 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MC7445ARX867LF | FREESCALE |
获取价格 |
RISC Microprocessor Hardware Specifications |
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MC7445ARX867LF | NXP |
获取价格 |
32-BIT, 867MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
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MC7445ARX867LG | FREESCALE |
获取价格 |
RISC Microprocessor Hardware Specifications |
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MC7445ARX933LF | FREESCALE |
获取价格 |
RISC Microprocessor Hardware Specifications |
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MC7445ARX933LF | NXP |
获取价格 |
32-BIT, 933MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
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MC7445ARX933LG | FREESCALE |
获取价格 |
RISC Microprocessor Hardware Specifications |
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MC7445L | MOTOROLA |
获取价格 |
Decoder/Driver, TTL, CDIP16 |
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MC7447A | FREESCALE |
获取价格 |
PowerPC microprocessor |
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MC7447AHX1000LB | NXP |
获取价格 |
APOLO7PM,RV1.1,1.3V,105C |
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MC7447AHX1000NB | NXP |
获取价格 |
32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAM |
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