Freescale
AO6415/MC6415
P-Channel 20-V (D-S) MOSFET
These miniature surface mount MOSFETs utilize a
high cell density trench process to provide low
rDS(on) and to ensure minimal power loss and heat
dissipation. Typical applications are DC-DC
converters and power management in portable and
battery-powered products such as computers,
printers, PCMCIA cards, cellular and cordless
telephones.
PRODUCT SUMMARY
VDS (V)
rDS(on) m(Ω)
ID (A)
-2.9
90 @ VGS = -4.5V
130 @ VGS = -2.5V
150 @ VGS = -1.8V
-20
-2.5
-2.3
•
•
Low rDS(on) provides higher efficiency and
extends battery life
1
2
3
6
5
4
Low thermal impedance copper leadframe
TSOP-6 saves board space
•
•
Fast switching speed
High performance trench technology
o
ABSOLUTE MAXIMUM RATINGS (TA = 25 C UNLESS OTHERWISE NOTED)
Parameter Symbol Maximum Units
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
-20
V
±12
TA=25oC
TA=70oC
-2.9
-2.4
±16
-1.0
2.0
Continuous Drain Currenta
ID
A
Pulsed Drain Currentb
Continuous Source Current (Diode Conduction)a
Power Dissipationa
IDM
IS
A
TA=25oC
TA=70oC
PD
W
1.3
oC
Operating Junction and Storage Temperature Range
TJ, Tstg -55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Units
Maximum
oC/W
oC/W
62.5
Maximum Junction-to-Ambienta
t <= 5 sec
RθJA
110
Notes
a.
b.
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature
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