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MC33662BLEF PDF预览

MC33662BLEF

更新时间： 2024-11-18 15:40:59
品牌 Logo 应用领域
恩智浦 - NXP 电信光电二极管电信集成电路
页数 文件大小 规格书
31页 589K
描述
Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps,TX/RX symmetry, SOIC 8, Rail

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MC33662BLEF 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Transferred包装说明：ROHS COMPLIANT, MS-012AA, SOIC-8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.68
JESD-30 代码：R-PDSO-G8JESD-609代码：e3
长度：4.9 mm湿度敏感等级：3
功能数量：1端子数量：8
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260座面最大高度：1.75 mm
标称供电电压：13.5 V表面贴装：YES
电信集成电路类型：INTERFACE CIRCUIT温度等级：AUTOMOTIVE
端子面层：Matte Tin (Sn)端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：40宽度：3.9 mm
Base Number Matches：1

MC33662BLEF 数据手册

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Document Number: MC33662  
Rev. 7.0, 1/2014  
escale Semiconductor  
Advance Information  
LIN 2.1 / SAEJ2602-2, LIN  
Physical Layer  
33662  
The Local Interconnect Network (LIN) is a serial communication  
protocol, designed to support automotive networks in conjunction with  
a Controller Area Network (CAN). As the lowest level of a hierarchical  
network, LIN enables cost-effective communication with sensors and  
actuators when all the features of CAN are not required.  
LINCELL  
The three 33662 versions are designed to operate at different  
maximum baud rates. The 33662LEF and 33662BLEF, and the  
33662SEF and 33662BSEF, offer a normal baud rate (20 kbps), and  
the 33662JEF and 33662BJEF, a slow baud rate (10 kbps). They  
integrate a fast baud rate (above 100 kbps), as reported by the RXD pin  
for test and programming modes. They provide excellent EMC  
(Electromagnetic Compatibility) and Radiated Emission performance,  
ESD (Electrostatic Discharge) robustness, and safe behavior, in the  
event of a LIN bus short-to-ground, or a LIN bus leakage during low-  
power mode. This device is powered by SMARTMOS technology.  
Features  
EF SUFFIX (PB-FREE)  
98ASB42564B  
• Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC,  
and handles 40 V during Load Dump  
8-PIN SOICN  
• Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and  
SAEJ2602-2  
• Active bus wave shaping, offering excellent radiated emission  
performance  
Applications  
• Automotive Market:  
• Body electronics (BCM, gateway, roof, door,  
lighting, HVAC)  
• Powertrain (EMS, start & stop), BMS  
• Safety & Chassis (TPMS, seat belt)  
• Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus,  
20 kV on the WAKE pin, and 25 kV on the VSUP pin  
• Very high immunity against electromagnetic interference  
• Low standby current in Sleep mode  
• Overtemperature protection  
• Local and remote Wake-up capability reported by the RXD pin  
• Fast baud rate selection reported by RXD pin  
• 5.0 V and 3.3 V compatible digital inputs without any required  
external components  
VBAT  
33662  
VSUP  
WAKE  
CAN SBC  
or  
VDD  
MCU  
Regulator  
INH  
LIN  
EN  
12 V  
RXD  
TXD  
LIN Interface  
5.0 V  
or 3.3 V  
GND  
Figure 1. 33662 Master LIN Bus Simplified Application Diagram  
* This document contains certain information on a new product.  
Specifications and information herein are subject to change without notice.  
© Freescale Semiconductor, Inc., 2011-2014. All rights reserved.  
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MC33662BLEF 替代型号

型号 品牌 替代类型 描述 数据表
MC33662LEF NXP

完全替代

 Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps,TX/RX symmetry, SOIC 8, Rail

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 		Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps,TX/RX symmetry, SOIC 8, Reel
MC33662BSEF NXP

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 		Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps, SOIC 8, Rail
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 		Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 10kbps, SOIC 8, Rail
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 		Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps,TX/RX symmetry, SOIC 8, Rail
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 		Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps, SOIC 8, Rail
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