MC33077
Low Noise Dual Operational
Amplifier
The MC33077 is a precision high quality, high frequency, low noise
monolithic dual operational amplifier employing innovative bipolar
design techniques. Precision matching coupled with a unique analog
resistor trim technique is used to obtain low input offset voltages.
Dual−doublet frequency compensation techniques are used to enhance
the gain bandwidth product of the amplifier. In addition, the MC33077
offers low input noise voltage, low temperature coefficient of input
offset voltage, high slew rate, high AC and DC open loop voltage gain
and low supply current drain. The all NPN transistor output stage
exhibits no deadband cross−over distortion, large output voltage
swing, excellent phase and gain margins, low open loop output
impedance and symmetrical source and sink AC frequency
performance.
http://onsemi.com
MARKING
DIAGRAMS
8
SOIC−8
D SUFFIX
CASE 751
33077
ALYW
8
1
1
8
1
The MC33077 is available in plastic DIP and SOIC−8 packages (P
and D suffixes).
PDIP−8
P SUFFIX
CASE 626
MC33077P
AWL
8
YYWW
Features
1
Ǹ
• Low Voltage Noise: 4.4 nV/ Hz @ 1.0 kHz
• Low Input Offset Voltage: 0.2 mV
• Low TC of Input Offset Voltage: 2.0 m V/°C
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
• High Gain Bandwidth Product: 37 MHz @ 100 kHz
• High AC Voltage Gain: 370 @ 100 kHz
1850 @ 20 kHz
WW, W = Work Week
PIN CONNECTIONS
• Unity Gain Stable: with Capacitance Loads to 500 pF
• High Slew Rate: 11 V/m s
Output 1
1
8 V
CC
• Low Total Harmonic Distortion: 0.007%
• Large Output Voltage Swing: +14 V to −14.7 V
• High DC Open Loop Voltage Gain: 400 k (112 dB)
• High Common Mode Rejection: 107 dB
• Low Power Supply Drain Current: 3.5 mA
• Dual Supply Operation: ±2.5 V to ±18 V
• Pb−Free Package is Available
−
+
2
7 Output 2
1
Inputs 1
3
6
5
−
+
2
Inputs 2
V
4
EE
(Dual, Top View)
ORDERING INFORMATION
†
Device
Package
SOIC−8
SOIC−8
Shipping
MC33077D
98 Units/Rail
MC33077DR2
2500 Tape & Reel
2500 Tape & Reel
MC33077DR2G
SOIC−8
(Pb−Free)
MC33077P
PDIP−8
50 Units/Rail
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
March, 2004 − Rev. 5
MC33077/D