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MC17XSF500EKR2 PDF预览

MC17XSF500EKR2

更新时间： 2024-11-25 21:11:39
品牌 Logo 应用领域
恩智浦 - NXP 驱动信息通信管理光电二极管接口集成电路驱动器
页数 文件大小 规格书
70页 1038K
描述
BUF OR INV BASED PRPHL DRVR

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中文翻译

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MC17XSF500EKR2 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：TransferredReach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.57驱动器位数：5
接口集成电路类型：BUFFER OR INVERTER BASED PERIPHERAL DRIVERJESD-30 代码：R-PDSO-G32
JESD-609代码：e3湿度敏感等级：3
端子数量：32最高工作温度：125 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：SSOP封装等效代码：SSOP32,.4
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）：260电源：5,7/18 V
认证状态：Not Qualified子类别：Peripheral Drivers
表面贴装：YES技术：BICMOS
温度等级：AUTOMOTIVE端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：0.635 mm
端子位置：DUAL处于峰值回流温度下的最长时间：40
Base Number Matches：1

MC17XSF500EKR2 数据手册

 浏览型号MC17XSF500EKR2的Datasheet PDF文件第2页浏览型号MC17XSF500EKR2的Datasheet PDF文件第3页浏览型号MC17XSF500EKR2的Datasheet PDF文件第4页浏览型号MC17XSF500EKR2的Datasheet PDF文件第5页浏览型号MC17XSF500EKR2的Datasheet PDF文件第6页浏览型号MC17XSF500EKR2的Datasheet PDF文件第7页 
Document Number: MC12XSFD1  
Rev. 1.0, 8/2016  
NXP Semiconductors  
Data Sheet: Advance Information  
17 mOhm and 7.0 mOhm high-side  
switches  
12XSFD1  
The 12XSF is the latest SMARTMOS achievement in DC motors and lighting  
drivers. It belongs to an expanding family that helps to control and diagnose  
incandescent lamps and light-emitting diodes (LEDs), with enhanced precision.  
It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and  
analog feedbacks, safety, and robustness.  
HIGH-SIDE SWITCHES  
Output edge shaping helps to improve electromagnetic performance. To avoid  
shutting off the device upon inrush current, while still being able to closely track  
the load current, a dynamic overcurrent threshold profile is featured. Current of  
each channel can be sensed with a programmable sensing ratio. Whenever  
communication with the external microcontroller is lost, the device enters a Fail  
operation mode, but remains operational, controllable, and protected.  
EK SUFFIX (PB-FREE)  
EK SUFFIX (PB-FREE)  
98ASA00368D  
98ASA00367D  
54-PIN SOIC-EP  
32-PIN SOIC-EP  
Applications  
• Low-voltage exterior lighting  
• Low-voltage industrial lighting  
• Halogen lamps  
This new generation of high-side switch products family facilitates ECU design  
due to compatible MCU software and PCB foot prints for each device variant.  
Features  
• Incandescent bulbs  
• Light-emitting diodes (LEDs)  
• HID Xenon ballasts  
• Quad or penta high-side switches with high transient capability  
• 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including  
PWM duty-cycles, output-ON and -OFF open load detections, thermal  
shutdown and prewarning, and fault reporting  
• DC motors  
• Low voltage automation systems  
• Output current monitoring with programmable synchronization signal and  
supply voltage feedback  
• Limp home mode  
• External smart power switch control  
• Operating voltage is 7.0 V to 18 V with sleep current < 5.0 µA, extended mode  
from 6.0 V to 28 V  
• -16 V reverse polarity and ground disconnect protections  
• Compatible PCB foot print and SPI software driver among the family  
V
PWR  
V
PWR  
VCC  
VPWR  
07XSF517B  
5.0 V  
Regulator  
VPWR  
VCC  
VCC  
SI  
CP  
SO  
CSB  
SCLK  
SI  
GND  
CSB  
SCLK  
SO  
RSTB  
CLK  
CSNS  
SYNCB  
LIMP  
IN1  
OUT1  
Solenoid  
OUT2  
OUT3  
OUT4  
OUT5  
LED Module  
RSTB  
CLK  
M
DC Motor  
Resistive load  
Bulb  
Main  
MCU  
A/D1  
TRG1  
PORT  
PORT  
PORT  
PORT  
PORT  
A/D2  
IN2  
IN3  
IN4  
OUT  
VPWR  
IN  
OUT6  
GND  
Smart Power  
Spare  
CSNS  
GND  
GND  
Figure 1. Triple 7.0 mΩ and dual 17 mΩ high-side simplified application diagram  
* This document contains certain information on a new product.  
Specifications and information herein are subject to change without notice.  
© 2016 NXP B.V.  
1234567...70

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