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MC17XS6400BEKR2 PDF预览

MC17XS6400BEKR2

更新时间: 2024-09-20 19:47:51
品牌 Logo 应用领域
恩智浦 - NXP 驱动接口集成电路
页数 文件大小 规格书
72页 1191K
描述
IC SWITCH HIGH SIDE 32SOIC

MC17XS6400BEKR2 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:,
Reach Compliance Code:compliant风险等级:5.84
接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVER湿度敏感等级:3
峰值回流温度(摄氏度):260处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

MC17XS6400BEKR2 数据手册

 浏览型号MC17XS6400BEKR2的Datasheet PDF文件第2页浏览型号MC17XS6400BEKR2的Datasheet PDF文件第3页浏览型号MC17XS6400BEKR2的Datasheet PDF文件第4页浏览型号MC17XS6400BEKR2的Datasheet PDF文件第5页浏览型号MC17XS6400BEKR2的Datasheet PDF文件第6页浏览型号MC17XS6400BEKR2的Datasheet PDF文件第7页 
Document Number: MC12XS6D1  
Rev. 5.0, 11/2018  
NXP Semiconductors  
Data sheet: Advance Information  
17 mOhm and 7.0 mOhm high-side  
switches  
MC07XS6517BEK; MC17XS6500BEK;  
MC17XS6500CEK; MC17XS6400BEK;  
MC17XS6400CEK  
The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers.  
It belongs to an expanding family, which helps to control and diagnose  
incandescent lamps and light-emitting diodes (LEDs), with enhanced precision.  
It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and  
analog feedbacks, safety, and robustness.  
High-side switches  
Output edge shaping helps to improve electromagnetic performance. To avoid  
shutting off the device upon inrush current, while still being able to closely track  
the load current, a dynamic overcurrent threshold profile is featured. Current of  
each channel can be sensed with a programmable sensing ratio. Whenever  
communication with the external microcontroller is lost, the device enters a fail  
operation mode, but remains operational, controllable, and protected.  
EK SUFFIX (PB-FREE)  
EK SUFFIX (PB-FREE)  
98ASA00368D AND  
98ASA00367D  
98ASA00894D  
54-PIN SOIC-EP  
32-PIN SOIC-EP  
Applications  
• Low-voltage automotive exterior lighting  
• Halogen lamps  
This new generation of high-side switch products family facilitates ECU design  
due to compatible MCU software and PCB foot prints for each device variant.  
• Incandescent bulbs  
Features  
• Light-emitting diodes (LEDs)  
• HID Xenon ballasts  
• Quad or penta high-side switches with high transient capability  
• 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including  
PWM duty cycles, output on and off open load detections, thermal shutdown  
and prewarning, and fault reporting  
• Output current monitoring with programmable synchronization signal and  
battery voltage feedback  
• Limp home mode  
• External smart power switch control  
• Operating voltage is 7.0 V to 18 V with sleep current < 5.0 µA, extended mode  
from 6.0 V to 28 V  
• -16 V reverse polarity and ground disconnect protections  
• Compatible PCB foot print and SPI software driver among the family  
V
BAT  
V
BAT  
VCC  
5.0 V  
Regulator  
VBAT  
07XS6517  
VBAT  
VCC  
SI  
VCC  
CP  
SO  
CSB  
SCLK  
SI  
GND  
CSB  
SCLK  
SO  
RSTB  
CLK  
CSNS  
SYNCB  
LIMP  
IN1  
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
RSTB  
CLK  
A/D1  
TRG1  
PORT  
Main  
MCU  
PORT  
PORT  
PORT  
IN2  
IN3  
OUT  
Smart Power  
CSNS  
VBAT  
IN  
IN4  
PORT  
A/D2  
OUT6  
GND  
GND  
GND  
Figure 1. Triple 7.0 mΩ and dual 17 mΩ high-side simplified application diagram  
* This document contains certain information on a new product.  
Specifications and information herein are subject to change without notice.  
© 2018 NXP B.V.  

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