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MC1496P PDF预览

MC1496P

更新时间: 2024-10-01 22:54:59
品牌 Logo 应用领域
安森美 - ONSEMI 商用集成电路光电二极管局域网
页数 文件大小 规格书
14页 216K
描述
BALANCED MODULATORS/DEMODULATORS

MC1496P 技术参数

是否无铅: 含铅生命周期:End Of Life
零件包装代码:DIP包装说明:PLASTIC, DIP-14
针数:14Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.03商用集成电路类型:CONSUMER CIRCUIT
JESD-30 代码:R-PDIP-T14JESD-609代码:e0
长度:18.86 mm功能数量:1
端子数量:14最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):240
认证状态:Not Qualified座面最大高度:4.19 mm
最大压摆率:9 mA最大供电电压 (Vsup):12 V
最小供电电压 (Vsup):12 V表面贴装:NO
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:7.62 mmBase Number Matches:1

MC1496P 数据手册

 浏览型号MC1496P的Datasheet PDF文件第2页浏览型号MC1496P的Datasheet PDF文件第3页浏览型号MC1496P的Datasheet PDF文件第4页浏览型号MC1496P的Datasheet PDF文件第5页浏览型号MC1496P的Datasheet PDF文件第6页浏览型号MC1496P的Datasheet PDF文件第7页 
MC1496, MC1496B  
Balanced Modulators/  
Demodulators  
These devices were designed for use where the output voltage is a  
product of an input voltage (signal) and a switching function (carrier).  
Typical applications include suppressed carrier and amplitude  
modulation, synchronous detection, FM detection, phase detection,  
and chopper applications. See ON Semiconductor Application Note  
AN531 for additional design information.  
http://onsemi.com  
SOIC−14  
D SUFFIX  
CASE 751A  
14  
Features  
1
Excellent Carrier Suppression −65 dB typ @ 0.5 MHz  
−50 dB typ @ 10 MHz  
Adjustable Gain and Signal Handling  
Balanced Inputs and Outputs  
High Common Mode Rejection −85 dB Typical  
This Device Contains 8 Active Transistors  
Pb−Free Package is Available*  
PDIP−14  
P SUFFIX  
CASE 646  
14  
1
PIN CONNECTIONS  
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
Signal Input  
Gain Adjust  
Gain Adjust  
Signal Input  
Bias  
V
EE  
N/C  
Output  
N/C  
Carrier Input  
N/C  
Output  
8
N/C  
Input Carrier  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 12 of this data sheet.  
DEVICE MARKING INFORMATION  
See general marking information in the device marking  
section on page 12 of this data sheet.  
*For additional information on our Pb−Free strategy  
and soldering details, please download the ON  
Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
April, 2004 − Rev. 9  
MC1496/D  

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