MC14521B
24−Stage Frequency Divider
The MC14521B consists of a chain of 24 flip−flops with an input
circuit that allows three modes of operation. The input will function as a
crystal oscillator, an RC oscillator, or as an input buffer for an external
oscillator. Each flip−flop divides the frequency of the previous flip−flop
24
by two, consequently this part will count up to 2 = 16,777,216. The
http://onsemi.com
count advances on the negative going edge of the clock. The outputs of
the last seven−stages are available for added flexibility.
MARKING
Features
DIAGRAMS
• All Stages are Resettable
16
• Reset Disables the RC Oscillator for Low Standby Power Drain
PDIP−16
P SUFFIX
CASE 648
MC14521BCP
AWLYYWWG
• RC and Crystal Oscillator Outputs Are Capable of Driving External
Loads
1
1
• Test Mode to Reduce Test Time
• V ′ and V ′ Pins Brought Out on Crystal Oscillator Inverter to
DD
SS
16
SOIC−16
D SUFFIX
CASE 751B
Allow the Connection of External Resistors for Low−Power Operation
14521BG
AWLYWW
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
1
1
• Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load over the Rated Temperature Range
• Pb−Free Packages are Available*
16
SOEIAJ−16
F SUFFIX
CASE 966
MC14521B
ALYWG
MAXIMUM RATINGS (Voltages Referenced to V
)
SS
1
1
Parameter
Symbol
Value
Unit
V
DC Supply Voltage Range
V
−0.5 to +18.0
DD
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
Input or Output Voltage Range
(DC or Transient)
V , V
in out
−0.5 to V
+0.5
V
DD
Input or Output Current (DC or Transient)
per Pin
I , I
in out
10
mA
G
= Pb−Free Package
Power Dissipation, per Package (Note 1)
Ambient Temperature Range
P
T
500
mW
°C
D
−55 to +125
−65 to +150
260
A
ORDERING INFORMATION
Storage Temperature Range
T
stg
°C
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Lead Temperature (8−Second Soldering)
T
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, V and V should be constrained
in
out
to the range V v (V or V ) v V
.
SS
in
out
DD
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either V or V ). Unused outputs must be left open.
SS
DD
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
June, 2006 − Rev. 6
MC14521B/D