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MC14503B_06 PDF预览

MC14503B_06

更新时间: 2024-01-05 01:41:42
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 113K
描述
Hex Non−Inverting 3−State Buffer

MC14503B_06 数据手册

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MC14049UB  
Hex Buffers  
The MC14049UB hex inverter/buffer is constructed with MOS  
P−channel and N−channel enhancement mode devices in a single  
monolithic structure. This complementary MOS device finds primary  
use where low power dissipation and/or high noise immunity is  
desired. This device provides logic−level conversion using only one  
http://onsemi.com  
supply voltage, V . The input−signal high level (V ) can exceed the  
DD  
IH  
V
DD  
supply voltage for logic−level conversions. Two TTL/DTL  
Loads can be driven when the device is used as CMOS−to−TTL/DTL  
MARKING  
DIAGRAMS  
converters (V = 5.0 V, V v 0.4 V, I 3.2 mA). Note that pins  
DD  
OL  
OL  
13 and 16 are not connected internally on this device; consequently  
connections to these terminals will not affect circuit operation.  
16  
PDIP−16  
P SUFFIX  
CASE 648  
MC14049UBCP  
AWLYYWW  
Features  
1
High Source and Sink Currents  
High−to−Low Level Converter  
Supply Voltage Range = 3.0 V to 18 V  
Meets JEDEC UB Specifications  
V can exceed V  
16  
SOIC−16  
D SUFFIX  
CASE 751B  
14049U  
AWLYWW  
1
IN  
DD  
Improved ESD Protection on All Inputs  
Pb−Free Packages are Available*  
16  
TSSOP−16  
DT SUFFIX  
CASE 948F  
14  
049U  
ALYW  
MAXIMUM RATINGS (Voltages Referenced to V  
)
SS  
Symbol  
Parameter  
Value  
Unit  
1
V
DC Supply Voltage Range  
0.5 to +18.0  
0.5 to +18.0  
V
V
DD  
16  
V
Input Voltage Range  
(DC or Transient)  
in  
SOEIAJ−16  
F SUFFIX  
CASE 966  
MC14049UB  
ALYW  
V
out  
Output Voltage Range  
(DC or Transient)  
−0.5 to V  
+0.5  
V
DD  
1
I
Input Current  
(DC or Transient) per Pin  
±10  
mA  
mA  
mW  
in  
A
= Assembly Location  
= Wafer Lot  
= Year  
I
Output Current  
(DC or Transient) per Pin  
+45  
out  
WL, L  
YY, Y  
P
Power Dissipation, per Package (Note 1)  
Plastic  
SOIC  
D
WW, W = Work Week  
825  
740  
T
Ambient Temperature Range  
55 to +125  
65 to +150  
260  
°C  
°C  
°C  
A
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
T
stg  
Storage Temperature Range  
T
Lead Temperature (8−Second Soldering)  
L
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
*For additional information on our Pb−Free strategy  
and soldering details, please download the  
ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
1. Temperature Derating: All Packages: See Figure 4.  
This device contains circuitry to protect the inputs against damage due to high  
static voltages or electric fields referenced to the V pin, only. Extra precautions  
SS  
must be taken to avoid applications of any voltage higher than the maximum rated  
voltages to this high−impedance circuit. For proper operation, the ranges V  
v
SS  
V
in  
v 18 V and V v V v V are recommended.  
SS  
out  
DD  
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,  
either V or V ). Unused outputs must be left open.  
SS  
DD  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
December, 2004 − Rev. 6  
MC14049UB/D  
 

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