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MC10H210MEL PDF预览

MC10H210MEL

更新时间: 2024-11-04 04:59:39
品牌 Logo 应用领域
安森美 - ONSEMI
页数 文件大小 规格书
6页 150K
描述
Dual 3−Input 3−Output OR Gate

MC10H210MEL 数据手册

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MC10H210  
Dual 3−Input 3−Output OR  
Gate  
Description  
The MC10H210 is designed to drive up to six transmission lines  
simultaneously. The multiple outputs of this device also allow the wire  
ORing of several levels of gating for minimization of gate and package  
count.  
The ability to control three parallel lines with minimum propagation  
delay from a single point makes the MC10H210 particularly useful in  
clock distribution applications where minimum clock skew is desired.  
http://onsemi.com  
MARKING DIAGRAMS*  
16  
Features  
MC10H210L  
AWLYYWW  
Propagation Delay Average, 1.0 ns Typical  
Power Dissipation, 160 mW Typical  
Improved Noise Margin 150 mV (Over Operating Voltage and  
Temperature Range)  
1
CDIP16  
L SUFFIX  
CASE 620A  
Voltage Compensated  
MECL 10KCompatible  
16  
1
PbFree Packages are Available*  
MC10H210P  
AWLYYWWG  
16  
LOGIC DIAGRAM  
1
5
6
7
2
3
4
PDIP16  
P SUFFIX  
CASE 648  
9
10  
11  
12  
13  
14  
10H210  
ALYWG  
V
V
V
= PINS 1, 15  
= PIN 16  
CC1  
CC2  
SOEIAJ16  
CASE 966  
= PIN 8  
EE  
DIP  
1 20  
PIN ASSIGNMENT  
V
A
V
V
B
B
B
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CC1  
CC2  
CC1  
OUT  
OUT  
OUT  
10H210G  
AWLYYWW  
20  
1
OUT  
OUT  
OUT  
PLLC20  
FN SUFFIX  
CASE 775  
A
A
A
IN  
A
= Assembly Location  
= Year  
WL, L = Wafer Lot  
YY, Y  
WW, W = Work Week  
G
A
B
B
B
IN  
IN  
IN  
IN  
A
IN  
= PbFree Package  
V
EE  
Pin assignment is for DualinLine Package.  
For PLCC pin assignment, see the Pin Conversion Tables on page 18  
of the ON Semiconductor MECL Data Book (DL122/D).  
*For additional marking information, refer to  
Application Note AND8002/D.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 Rev. 7  
MC10H210/D  

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