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MC10H162MEL PDF预览

MC10H162MEL

更新时间: 2024-09-23 05:10:23
品牌 Logo 应用领域
安森美 - ONSEMI 解码器驱动器逻辑集成电路光电二极管
页数 文件大小 规格书
7页 164K
描述
Binary to 1−8 Decoder (High)

MC10H162MEL 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:EIAJ, SOP-16
针数:16Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.61Is Samacsys:N
系列:10H输入调节:STANDARD
JESD-30 代码:R-PDSO-G16JESD-609代码:e4
长度:10.2 mm逻辑集成电路类型:OTHER DECODER/DRIVER
功能数量:1端子数量:16
最高工作温度:75 °C最低工作温度:
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP16,.3
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
包装方法:TAPE AND REEL最大电源电流(ICC):84 mA
Prop。Delay @ Nom-Sup:2.6 ns传播延迟(tpd):2.1 ns
认证状态:Not Qualified座面最大高度:2.05 mm
子类别:Decoder/Drivers表面贴装:YES
技术:ECL温度等级:COMMERCIAL EXTENDED
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:5.275 mmBase Number Matches:1

MC10H162MEL 数据手册

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MC10H162  
Binary to 1−8 Decoder  
(High)  
Description  
The MC10H162 provides parallel decoding of a three bit binary  
word to one of eight lines. The MC10H162 is useful in highspeed  
multiplexer/ demultiplexer applications.  
The MC10H162 is designed to decode a three bit input word to one  
of eight output lines. The MC10H162 output will be high when  
selected while all other output are low. The enable inputs, when either  
or both are high, force all outputs low.  
http://onsemi.com  
MARKING DIAGRAMS*  
16  
The MC10H162 is a true parallel decoder. This eliminates unequal  
parallel path delay times found in other decoder designs. These  
devices are ideally suited for multiplexer/demultiplexer applications.  
MC10H162L  
AWLYYWW  
1
CDIP16  
L SUFFIX  
CASE 620A  
Features  
Propagation Delay, 1.0 ns Typical  
Power Dissipation, 315 mW Typical (same as MECL 10K)  
Improved Noise Margin 150 mV (Over Operating Voltage and  
16  
1
Temperature Range)  
MC10H162P  
AWLYYWWG  
16  
Voltage Compensated  
1
MECL 10K Compatible  
PDIP16  
P SUFFIX  
CASE 648  
PbFree Packages are Available*  
10H162  
ALYWG  
SOEIAJ16  
CASE 966  
1 20  
10H162G  
AWLYYWW  
20  
1
PLLC20  
FN SUFFIX  
CASE 775  
A
= Assembly Location  
= Year  
WL, L = Wafer Lot  
YY, Y  
WW, W = Work Week  
G
= PbFree Package  
*For additional marking information, refer to  
Application Note AND8002/D.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 Rev. 7  
MC10H162/D  

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