是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Lifetime Buy | 零件包装代码: | DFN |
包装说明: | HVSON, | 针数: | 8 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.58 | 其他特性: | NECL MODE VCC=0V, WITH VEE=-4.2V TO -5.5V SUPPLY |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-XDSO-N8 |
JESD-609代码: | e3 | 长度: | 2 mm |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVSON |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.2 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | BIPOLAR |
温度等级: | INDUSTRIAL | 端子面层: | MATTE TIN |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 2 mm | Base Number Matches: | 1 |
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