Datasheet > MC-212SD06

MC-212SD06

更新时间： 2024-02-11 00:06:40

品牌	Logo	应用领域
广濑 - HRS		瞄准线射频微波
页数	文件大小	规格书
2页	101K
描述
45 MHz - 104 MHz RF/MICROWAVE SPLITTER AND COMBINER, 0.6 dB INSERTION LOSS

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技术参数
数据手册

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MC-212SD06 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.37	Is Samacsys：	N
特性阻抗：	50 Ω	最大插入损耗：	0.6 dB
最大工作频率：	104 MHz	最小工作频率：	45 MHz
射频/微波设备类型：	SPLITTER AND COMBINER	最大电压驻波比：	1.2
Base Number Matches：	1

MC-212SD06 数据手册

MC-200SC,MC200SD Series (30 to 370 MHz)

■Specifications

Balance

(deg) (dB)

(MHZ)

(deg)

(dB Max)

(dB Min)

Isolation

V.S.W.R.

(Max)

(Ω)

Impedance

(g)

Weight

Model No. Frequency Phase a above 3dB

Range Difference Insertion Loss

Phase Amplitude

MC-201SC

MC-212SC

MC-217SC

MC-218SC

MC-201SD

MC-211SD

MC-212SD

MC-213SD

030~200

050~095

045~070

070~100

030~230

170~230

045~104

330~370

0.6

1.3

1.2

1.3

1.2

1.4

±3

±4

±0.1

±0.5

±0.15

±0.5

- 90

NOTE 1: The insertion loss of the 2-way 90˚type is the average output of the 0˚port and the -90˚port minus 3 dB coupling.

NOTE 2: When ordering items with embossed tape packaging, affix (06) to the end of the product number. One reel contains 500 pieces.

■Function Diagram

■Recommended Board Pattern

Pins 2, 3, 4, 5, and 6 are ground.

Pins 3, 4, 7, and 8 are ground.

●Please apply resist processing to the area around the

electrode pads.

■Usage Precautions

1.Soldering

(1)Recommended temperature profile

(2)Recommended hand soldering conditions

Soldering iron temperature: 260˚C

Soldering time: Within 10 seconds

(3)Recommended screen thickness0.15 mm

Preheating

40 to 120 s

Soldering

20 to 60 s

Slow cooling

Natural cooling

for 1 min. or longer

1Up to two cycles are permitted at the same conditions provided that the item is at

room temperature between the first and second cycle.

2The temperature indicates the board surface temperature of the contact lead

portion.

3Reflow soldering should be performed at a peak temperature of 240˚C or less at

the surface of the printed circuit board.

4The temperature profile will change depending on the conditions which include

board size, solder used, and solder thickness.

1After opening the package reseal promptly or store in a desiccator with a

2.Product Storage

desiccant.

2Store in a place that is not exposed to harmful gases which include sulfur or

chlorine, etc.

3Use within one year of delivery.

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