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MBRF201500CT PDF预览

MBRF201500CT

更新时间: 2024-01-11 03:18:37
品牌 Logo 应用领域
辰达行 - MDD /
页数 文件大小 规格书
2页 696K
描述
150 to 200 Volts Forward Current - 20.0 Amperes

MBRF201500CT 数据手册

 浏览型号MBRF201500CT的Datasheet PDF文件第2页 
MBRF201500CT THRU MBRF20200CT  
SCHOTTKY BARRIER RECTIFIER  
Reverse Voltage - 150 to 200 Volts Forward Current -20.0 Amperes  
ITO-220AB  
FEATURES  
4.5± 0.2  
10.2± 0.2  
+0.2  
-0.1  
3.1  
High surge capacity.  
For use in low voltage, high frequency inverters,free  
wheeling,and polarity protection applications.  
Metal silicon junction,majority carrier conduction.  
High current capability,low forward voltage drop.  
Guard ring for over voltage protection.  
PIN  
1
2
3
4.0± 0.3  
2.6± 0.2  
MECHANICAL DATA  
1.4± 0.1  
0.6± 0.1  
Case: ITO-220AB molded plastic body  
Terminals: Leads solderable per MIL-STD-750,  
Method 2026  
0.6± 0.1  
2.6± 0.15  
PIN 2  
CASE  
PIN 1  
PIN 3  
Polarity: As marked  
Mounting Position: Any  
Weight:0.060 ounce, 1.67 grams  
Dimensions in inches and (millimeters)  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Ratings at 25 C ambient temperature unless otherwise specified.  
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.  
SYMBOLS  
UNITS  
MDD Catalog  
MBRF20200CT  
Number  
MBRF  
20150CT  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
200  
140  
200  
VOLTS  
VOLTS  
VOLTS  
150  
135  
150  
VRRM  
VRMS  
VDC  
Maximum DC blocking voltage  
Maximum average forward rectified current  
(see fig.1)  
I(AV)  
20.0  
Amps  
Peak forward surge current  
IFSM  
150.0  
8.3ms single half sine-wave superimposed on  
rated load (JEDEC Method)  
Amps  
VF  
IR  
0.95  
0.2  
Maximum instantaneous forward voltage at 10.0A  
Volts  
mA  
Maximum DC reverse current  
at rated DC blocking voltage  
TA=25 C  
TA=100 C  
50.0  
C/W  
C
Maximum thermal resistance(NOTE 1)  
Operating junction temperature range  
RθJC  
1.5  
-55 to +150  
TJ  
Storage temperature range  
C
TSTG  
-55 to +150  
Note:  
1.Thermal resistance from junction to case  

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