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MBRB40200CT PDF预览

MBRB40200CT

更新时间: 2024-09-28 14:54:47
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
3页 869K
描述
Tube: 50pcs/Tube, 5K/Ctn,Tape : 800pcs/Reel , 8K/Ctn.;

MBRB40200CT 数据手册

 浏览型号MBRB40200CT的Datasheet PDF文件第2页浏览型号MBRB40200CT的Datasheet PDF文件第3页 
MBRB40200CT  
Features  
Halogen Free. "Green" Device (Note 1)  
Lead Free Finish/RoHS Compliant(Note 2) ("P" Suffix Designates  
Compliant. See Ordering Information)  
40 Amp  
High Current Capability and High Efficiency.  
Epoxy Meets UL 94 V-0 Flammability Rating  
Moisture Sensitivity Level 1  
Schottky  
Barrier Rectifier  
200 Volts  
Maximum Ratings  
Operating Junction Temperature Range: -55⁰C to +150⁰C  
Storage Temperature Range: -55⁰C to +150⁰C  
Typical Thermal Resistance: 2 ⁰C/W Junction to Case  
D2-PAK  
Maximum  
Maximum  
Recurrent  
Peak Reverse  
Voltage  
Maximum  
RMS  
Voltage  
DC  
Blocking  
Voltage  
MCC  
Device  
S
Part Number  
Marking  
V
A
1
2
3
MBRB40200CT MBRB40200CT  
200V  
140V  
200V  
G
4
B
Electrical Characteristics @ 25°C Unless Otherwise Specified  
D
H
Average Rectified  
Forward Current (Rated  
VR-20Khz Square Wave)  
- 50% Duty Cycle  
C
IF(AV)  
40A  
TC=120C  
w
E
J
K
Peak Forward Surge  
Current  
IFSM  
450A  
8.3ms,Half Sine Wave  
DIMENSIONS  
MM  
MIN MAX MIN MAX  
0.331 0.370 8.40 9.40  
0.378 0.417 9.60 10.60  
0.165 0.189 4.20 4.80  
0.027 0.037 0.68 0.94  
0.045 0.055 1.14 1.40  
INCHES  
DIM  
NOTE  
TYP.  
IF=20A;  
0.84V(Typ)  
0.90V(Max)  
Maximum  
Instantaneous  
Forward Voltage  
A
B
C
D
E
G
H
J
K
S
V
W
TJ=25C  
VF  
0.80V(Max)  
IF=20A;  
TJ=125C  
Maximum Reverse  
Current at Rated  
DC Blocking  
0.10  
2.54  
0.01mA  
5mA  
TJ=25C  
0.096 0.134 2.43 3.40  
0.011 0.025 0.28 0.64  
0.071 0.131 1.80 3.32  
0.575 0.625 14.60 15.87  
0.042 0.058 1.07 1.47  
0.000 0.010 0.00 0.25  
IR  
TJ=125⁰C  
Voltage  
Note:  
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,  
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
2. High temperature solder exemption applied, see EU directive annex 7a.  
Suggested Solder Pad Layout  
Unit:mm  
Internal Structure  
10.26  
1.78  
1
2 , 4  
HEATSINK  
3.50  
10.66  
5.08  
3
8.38  
Rev.3-4-08202023  
1/3  
MCCSEMI.COM  

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