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MBR1660CT PDF预览

MBR1660CT

更新时间: 2024-10-01 14:52:59
品牌 Logo 应用领域
强茂 - PANJIT 局域网功效瞄准线二极管
页数 文件大小 规格书
4页 88K
描述
TO-220AB

MBR1660CT 数据手册

 浏览型号MBR1660CT的Datasheet PDF文件第2页浏览型号MBR1660CT的Datasheet PDF文件第3页浏览型号MBR1660CT的Datasheet PDF文件第4页 
MBR1640CT~MBR16200CT  
SCHOTTKY BARRIER RECTIFIERS  
40 to 200 Volt  
VOLTAGE  
CURRENT 16 Ampere  
FEATURES  
• Plastic package has Underwriters Laboratory  
Flammability Classification 94V-O utilizing  
Flame Retardant Epoxy Molding Compound.  
• Low power loss, high efficiency.  
• Low forward voltage, high current capability  
• High surge capacity.  
• For use in low voltage, high frequency inverters  
free wheeling, and polarlity protection applications.  
• Lead free in compliance with EU RoHS 2011/65/EU directive  
• Green molding compound as per IEC61249 Std. . (Halogen Free)  
MECHANICAL DATA  
• Case: TO-220AB molded plastic package  
Terminals: Lead solderable per MIL-STD-750, Method 2026  
• Polarity: As marked.  
• Weight: 0.067 ounces, 1.89 grams  
MAXIMUM RATINGS  
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.  
For capacitive load, derate current by 20%  
MBR1640CT MBR1645CT MBR1650CT MBR1660CT MBR1680CT MBR1690CT MBR16100CT MBR16150CT MBR16200CT  
PARAMETER  
SYMBOL  
VRRM  
UNITS  
V
Maximum Recurrent Peak Reverse Voltage  
40  
28  
40  
45  
31.5  
45  
50  
35  
50  
60  
42  
60  
80  
56  
80  
90  
63  
90  
100  
70  
150  
105  
150  
200  
140  
200  
Maximum RMS Voltage  
VRMS  
V
V
Maximum DC Blocking Voltage  
Maximum Average Forward (See Figure 1)  
VDC  
100  
IF(AV)  
16  
A
Peak Forward Surge Current  
superimposed on rated load  
: 8.3ms single half sine-wave  
IF SM  
150  
A
Maximum Forward Voltage at 8A per leg  
VF  
0.7  
0.75  
0.8  
0.9  
V
Maximum DC Reverse Current at Rated DC Blocking TJ=25O  
Voltag  
C
0.05  
20  
IR  
mA  
TJ=100O  
C
Typical Thermal Resistance  
RθJC  
2
OC  
/ W  
OC  
-55 to +150  
Operating Junction and Storage Temperature Range  
TJ,TSTG  
-65 to +175  
NOTES:Both Bonding and Chip structure are available.  
October 21,2016-REV.03  
PAGE . 1  

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