MBR10L100CT-T
10A Trench Schottky Rectifier
Chip Integration Technology Corporation
Main Product Characteristics
■ Outline
Dimensions in inches(millimeters)
TO-220AB
K
symbol
IF(AV)
VRRM
TJ
5 X 2A
Min
Max
L
ØP
A
A
B
0.398(10.1)
0.236(6.0)
0.579(14.7)
0.543(13.8)
0.143(3.63)
0.104(2.64)
0.335(8.5)
0.046(1.17)
0.028(0.71)
0.098(2.49)
0.176(4.47)
0.046(1.17)
0.102(2.6)
0.019(0.28)
0.147(3.74)
0.406(10.3)
0.252(6.4)
0.594(15.1)
0.551(14.0)
0.159(4.03)
0.112(2.84)
0.350(8.9)
0.054(1.37)
0.036(0.91)
0.102(2.59)
0.184(4.67)
0.054(1.37)
0.110(2.8)
0.021(0.48)
0.155(3.94)
100V
F
C
D
E
-55 to +150OC
0.56V
B
C
VF(Typ)
Marking code
F
G
C
G
H
I
M
H
E
■ Features
J
I
K
D
L
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
M
N
ØP
J
N
Alternate
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Dimensions in inches(millimeters)
K
symbol
Min
Max
0.413(10.5)
0.268(6.8)
L
ØP
A
A
B
0.394(10.0)
0.228(5.8)
0.570(14.48) 0.625(15.87)
0.519(13.18) 0.558(14.18)
F
■ Mechanical data
C
D
E
B
C
0.089(3.5)
0.100(2.54)
0.330(8.38)
0.045(1.15)
0.029(0.75)
0.095(2.42)
0.160(4.07)
0.045(1.15)
0.080(2.04)
0.013(0.33)
0.148(3.75)
0.099(3.9)
0.120(3.04)
0.350(8.9)
0.060(1.52)
0.037(0.95)
0.105(2.66)
0.190(4.82)
0.055(1.39)
0.110(2.8)
• Epoxy : UL94-V0 rated flame retardant.
• Case : JEDEC TO-220AB molded plastic body.
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026.
• Polarity: As marked.
• Mounting Position : Any.
Marking code
F
G
G
H
I
M
H
E
J
I
K
D
L
M
N
ØP
0.019(0.52)
0.156(3.95)
J
N
• Weight : Approximated 2.25 gram.
Dimensions in inches and (millimeters)
■ Circuit Diagram
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified.
Parameter
Conditions
Symbol
VRWM
IO
MBR10L100CT-T
UNIT
Working peak reverse voltage
Forward rectified current (total device)
100
10
V
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
IFSM
150
A
Peak Forward surge current
Peak repetitive reverse surge current
Typical Thermal resistance (per leg)
2us-1Khz
IRRM
RθJC
RθJA
1
2
OC/W
OC/W
OC
Junction to case
Junction to ambient
50
Storage temperature
TSTG
TJ
-55 ~ +150
-55 ~ +150
OC
Operating Junction temperature
Parameter
Conditions
IF = 3A, TJ = 25OC
IF = 5A, TJ = 25OC
Symbol
VF
MIN.
TYP.
550
630
560
3
MAX.
UNIT
Instantaneous Forward voltage drop
(per diode)
670
mV
IF = 5A, TJ = 125OC
Instantaneous Reverse current
(per diode)
VR = 100V
VR = 100V
TJ = 25OC
TJ = 125OC
50
25
uA
IR
3
mA
Reverse Breakdown Voltage (per diode)
IR = 0.1mA, TJ = 25OC
VBR
100
Document ID : DS-11KHY
Revised Date : 2016/08/15
Revision : C1
1