MBR10100MFS,
NRVB10100MFS
SWITCHMODE
Power Rectifiers
Features
• Low Power Loss / High Efficiency
http://onsemi.com
• New Package Provides Capability of Inspection and Probe After
Board Mounting
SCHOTTKY BARRIER
RECTIFIERS
• Guardring for Stress Protection
• Low Forward Voltage Drop
• 175°C Operating Junction Temperature
• Wettable Flacks Option Available
10 AMPERES
100 VOLTS
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
5,6
1,2,3
• These are Pb−Free Devices
MARKING
DIAGRAM
Mechanical Characteristics:
A
C
C
• Case: Epoxy, Molded
1
B10100
AYWZZ
A
A
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
Not Used
B10100 = Specific Device Code
A
Y
W
ZZ
= Assembly Location
= Year
• Device Meets MSL 1 Requirements
MAXIMUM RATINGS
= Work Week
= Lot Traceability
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
RRM
V
RWM
V
100
10
R
ORDERING INFORMATION
Average Rectified Forward Current
I
A
A
F(AV)
Device
Package
Shipping†
1500 /
(Rated V , T = 165°C)
R
C
Peak Repetitive Forward Current,
I
20
MBR10100MFST1G
SO−8 FL
FRM
(Rated V , Square Wave,
(Pb−Free) Tape & Reel
R
20 kHz, T = 163°C)
C
MBR10100MFST3G
NRVB10100MFST1G
SO−8 FL 5000 /
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
I
150
A
FSM
(Pb−Free) Tape & Reel
SO−8 FL 1500 /
(Pb−Free) Tape & Reel
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
Storage Temperature Range
T
−65 to +175
−55 to +175
75
°C
°C
mJ
NRVB10100MFST3G
stg
Operating Junction Temperature
T
J
Unclamped Inductive Switching
Energy (10 mH Inductor,
Non−repetitive)
E
AS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
ESD Rating (Human Body Model)
ESD Rating (Machine Model)
3B
M4
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NOTE: The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RJA.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
October, 2013 − Rev. 0
MBR10100MFS/D