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MBQ50T65FESCTH

更新时间: 2024-11-18 01:22:59
品牌 Logo 应用领域
美格纳 - MGCHIP 双极性晶体管
页数 文件大小 规格书
8页 1888K
描述
650V Field Stop IGBT

MBQ50T65FESCTH 数据手册

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MBQ50T65FESC  
650V Field Stop IGBT  
General Description  
Features  
High Speed Switching & Low Power Loss  
VCE(sat) = 1.85V @ IC = 50A  
Eoff = 0.55mJ @ TC = 25°C  
This IGBT is produced using advanced MagnaChip’s Field  
Stop Trench IGBT Technology, which provides high switching  
series and excellent quality.  
High Input Impedance  
trr = 80ns (typ.) @diF/dt = 1000A/ μs  
Maximum junction temperature 175°C  
This device is for PFC, UPS & Inverter applications.  
Applications  
PFC  
Welder  
UPS  
IH Cooker  
PV Inverter  
TO-247  
G
C
E
Maximum Rating  
Parameter  
Symbol  
Rating  
650  
100  
50  
Unit  
V
Collector-emitter voltage  
VCE  
TC=25°C  
DC collector current, limited by Tvjmax  
TC=100°C  
A
IC  
A
Pulsed collector current, tp limited by Tjvjmax  
ICpuls  
-
200  
200  
60  
A
Turn off safe operating area VCE 650V, Tvj 175°C  
A
TC=25°C  
Diode forward current limited by Tvjmax  
TC=100°C  
IF  
A
30  
Diode pulsed current, tp limited by Tvjmax  
Gate-emitter voltage  
IFpuls  
VGE  
200  
±20  
375  
188  
A
V
TC=25°C  
W
W
Power dissipation  
PD  
TC=100°C  
Short circuit withstand time  
VCC 400V, VGE = 15V, Tvj = 150°C  
Allowed number of short circuits < 1000  
Time between short circuits 1.0s  
tsc  
5
μs  
Operating Junction temperature range  
Storage temperature range  
Tvj  
-40~175  
-55~150  
°C  
°C  
Tstg  
Soldering temperature  
Wave soldering 1.6 mm (0.063 in.) from case for 10s  
Mounting torque, M3 screw  
Maximum of mounting processes: 3  
260  
0.6  
°C  
M
Nm  
Thermal Characteristic  
Parameter  
Thermal resistance junction-to-ambient  
Thermal resistance junction-to-case for IGBT  
Thermal resistance junction-to-case for Diode  
Symbol  
RθJA  
Rating  
40  
Unit  
RθJC  
0.4  
°C/W  
RθJC  
1.2  
1
Sep. 2015 Revision 0.0  
MagnaChip Semiconductor Ltd.  

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