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MBM29SL800TD-10PBT-E1 PDF预览

MBM29SL800TD-10PBT-E1

更新时间: 2024-11-19 14:23:31
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路
页数 文件大小 规格书
60页 392K
描述
Flash, 512KX16, 100ns, PBGA48, PLASTIC, FBGA-48

MBM29SL800TD-10PBT-E1 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:PLASTIC, FBGA-48
针数:48Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.41最长访问时间:100 ns
其他特性:ALSO CONFIGURABLE AS 1M X 8备用内存宽度:8
启动块:TOPJESD-30 代码:R-PBGA-B48
JESD-609代码:e1长度:9 mm
内存密度:8388608 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
端子数量:48字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):260编程电压:1.8 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):2.2 V最小供电电压 (Vsup):1.8 V
标称供电电压 (Vsup):2 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40类型:NOR TYPE
宽度:6 mmBase Number Matches:1

MBM29SL800TD-10PBT-E1 数据手册

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MBM29SL800TD/BD-10/12  
Data Sheet (Retired Product)  
MBM29SL800TD/BD-10/12Cover Sheet  
This product has been retired and is not recommended for new designs. Availability of this document is retained for reference  
and historical purposes only.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been  
made are the result of normal data sheet improvement and are noted in the document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number MBM29SL800TD/BD  
Revision DS05-20871-6E  
Issue Date July 31, 2007  

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