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MBM29F040C-55PD PDF预览

MBM29F040C-55PD

更新时间: 2024-11-03 03:52:31
品牌 Logo 应用领域
飞索 - SPANSION 闪存内存集成电路
页数 文件大小 规格书
41页 423K
描述
FLASH MEMORY 4M (512K x 8) BIT

MBM29F040C-55PD 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:QFJ
包装说明:QCCJ, LDCC32,.5X.6针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.42
最长访问时间:55 ns命令用户界面:YES
数据轮询:YES耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PQCC-J32JESD-609代码:e0
长度:13.97 mm内存密度:4194304 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1部门数/规模:8
端子数量:32字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX8封装主体材料:PLASTIC/EPOXY
封装代码:QCCJ封装等效代码:LDCC32,.5X.6
封装形状:RECTANGULAR封装形式:CHIP CARRIER
并行/串行:PARALLEL峰值回流温度(摄氏度):240
电源:5 V编程电压:5 V
认证状态:Not Qualified座面最大高度:3.56 mm
部门规模:64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.045 mA
最大供电电压 (Vsup):5.25 V最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:J BEND
端子节距:1.27 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30切换位:YES
类型:NOR TYPE宽度:11.43 mm
Base Number Matches:1

MBM29F040C-55PD 数据手册

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TM  
SPANSION Flash Memory  
Data Sheet  
September 2003  
This document specifies SPANSIONTM memory products that are now offered by both Advanced Micro Devices and  
Fujitsu. Although the document is marked with the name of the company that originally developed the specification,  
these products will be offered to customers of both AMD and Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a SPANSIONTM product. Future routine  
revisions will occur when appropriate, and changes will be noted in a revision summary.  
Continuity of Ordering Part Numbers  
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these  
products, please use only the Ordering Part Numbers listed in this document.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about SPANSIONTM memory  
solutions.  

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4M (512K X 8) BIT