是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | TFBGA, |
针数: | 57 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.53 | 最长访问时间: | 120 ns |
备用内存宽度: | 8 | 启动块: | BOTTOM |
JESD-30 代码: | R-PBGA-B57 | JESD-609代码: | e0 |
长度: | 13.95 mm | 内存密度: | 33554432 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 57 |
字数: | 2097152 words | 字数代码: | 2000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 2MX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 240 |
编程电压: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
类型: | NOR TYPE | 宽度: | 7.95 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MBM29DL322BD-12PBT | SPANSION |
获取价格 |
Flash, 2MX16, 120ns, PBGA57, PLASTIC, FBGA-57 | |
MBM29DL322BD12PFTN | FUJITSU |
获取价格 |
2MX16 FLASH 3V PROM, 120ns, PDSO48, PLASTIC, TSOP1-48 | |
MBM29DL322BD12PFTN | SPANSION |
获取价格 |
Flash, 2MX16, 120ns, PDSO48, PLASTIC, TSOP1-48 | |
MBM29DL322BD-12PFTN | SPANSION |
获取价格 |
2MX16 FLASH 3V PROM, 120ns, PDSO48, PLASTIC, TSOP1-48 | |
MBM29DL322BD12PFTN-E1 | SPANSION |
获取价格 |
Flash, 2MX16, 120ns, PDSO48, PLASTIC, TSOP1-48 | |
MBM29DL322BD12PFTR | SPANSION |
获取价格 |
2MX16 FLASH 3V PROM, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | |
MBM29DL322BD-12PFTR | FUJITSU |
获取价格 |
Flash, 4MX8, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | |
MBM29DL322BD12PFTR-E1 | SPANSION |
获取价格 |
Flash, 2MX16, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | |
MBM29DL322BD-80 | FUJITSU |
获取价格 |
32M (4M X 8/2M X 16) BIT Dual Operation | |
MBM29DL322BD80PBT | SPANSION |
获取价格 |
Flash, 2MX16, 80ns, PBGA57, PLASTIC, FBGA-57 |