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MBF110PFW1LPES PDF预览

MBF110PFW1LPES

更新时间: 2024-10-20 21:54:11
品牌 Logo 应用领域
富士通 - FUJITSU 模拟IC传感器信号电路光电二极管
页数 文件大小 规格书
24页 238K
描述
Solid-State Fingerprint Sensor

MBF110PFW1LPES 技术参数

是否Rohs认证:不符合生命周期:Active
零件包装代码:SOIC包装说明:SSOP, SSOP80,1,20
针数:80Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.09
Is Samacsys:N其他特性:ALSO REQUIRES A 3V TO 5.5V DIGITAL SUPPLY
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:S-PDSO-G80
长度:24 mm功能数量:1
端子数量:80最高工作温度:60 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP80,1,20
封装形状:SQUARE封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3/5 V
认证状态:Not Qualified子类别:Other Analog ICs
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:24 mm
Base Number Matches:1

MBF110PFW1LPES 数据手册

 浏览型号MBF110PFW1LPES的Datasheet PDF文件第2页浏览型号MBF110PFW1LPES的Datasheet PDF文件第3页浏览型号MBF110PFW1LPES的Datasheet PDF文件第4页浏览型号MBF110PFW1LPES的Datasheet PDF文件第5页浏览型号MBF110PFW1LPES的Datasheet PDF文件第6页浏览型号MBF110PFW1LPES的Datasheet PDF文件第7页 
MBF110  
Solid-State Fingerprint Sensor  
Packages  
Overview  
The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct  
contact, fingerprint acquisition device. It is a high performance,  
low power, low cost, capacitive sensor with an integrated two-  
dimensional array of metal electrodes in the sensing array. Each  
metal electrode acts as one plate of a capacitor and the contacting  
finger acts as the second plate.A passivation layer on the device  
surface forms the dielectric between these two plates. Ridges and  
valleys on the finger yield varying capacitor values across the array,  
which is read to form an image of the fingerprint.  
80-pin SOP (VSPA)  
80-pinTSOP (LQFP)  
A block diagram of the MBF110 is shown in Figure 1.The  
MBF110 has an integrated 8-bit flash analog-to-digital converter  
to digitize the output of the sensor array.The fingerprint image is  
transmitted on an 8-bit bi-directional bus interface compatible  
with most microprocessors.  
The MBF110 is manufactured in standard CMOS technology and  
is available in an 80-pin,VSPA 80/1 and LQFP 80/1.The 300 ×  
300 sensor array has a 50 µm pitch and yields a 500-dpi image.The  
sensor surface is protected by a patented, ultra-hard, abrasion and  
chemical resistant coating.  
For SETCUR resistor differences between the MBF110 see the Pin  
Information table.  
Applications  
Features  
• Database and network access  
• Portable fingerprint acquisition  
• Access control (home, auto, office, etc.)  
• ATM  
• Non-optical solid-state device  
• 300 × 300 sensor array, 50 µm pitch  
• 1.5 cm × 1.5 cm sensor area  
• 500-dpi resolution  
• Smart cards  
• Operation from 3V to 5.5V  
• Ultra-hard protective coating  
• Integrated 8-bit flash analog-to-digital converter  
• 8-bit microprocessor interface  
• Standard CMOS technology  
• Low power, less than 200 mW  
• Cellular phone security access  

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