MBCR10D THRU MBCR10M
MINIATURE SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Reverse Voltage - 200 to 1000 Volts
Forward Current - 1.0 Ampere
D
E
T
N
E
T
A
P
MBCR
FEATURES
Mounting Pad Layout
0.213(5.40)
0.205(5.20)
* Internal Constructure with GPRC (Glass Passivated Rectifier Chip)
inside
0.165(4.20)
0.157(4.00)
0.132(3.35)
0.128(3.25)
* Lead free product
* Leadless chip form , no lead damage
* Solder Joint , No Wire bond & Lead Frame
* Low profile package
* For surface mounted applications
* Built-in strain relief
~
~
0.037(0.95)
0.033(0.85)
* Low power loss , High efficiency
* High current capability
0.040(1.0)
0.031(0.8)
* High surge capacity
* Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
0.051(1.30)
0.043(1.10)
MECHANICAL DATA
*Dimensions in inches and (millimeters)
Case : Packed with FRP substrate and epoxy underfilled
Terminals : Tin plated , solderable per MIL-STD-750,
Method 2026
SuperBridge with GPRC inside
TM
Polarity : Laser marking
Weight : 0.07 gram
TM
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature
SYMBOLS MBCR10D
MBCR10G
MBCR10J
MBCR10K
MBCR10M UNITS
unless otherwise specified.
Volts
Volts
Volts
Maximum repetitive peak reverse voltage
Maximum RMS voltage
V
RRM
RMS
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
V
1000
Maximum DC blocking voltage
V
DC
Maximum average forward rectified current @ T
A
=55oC
I
(AV)
1.0
30
Amps
Amps
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
I
FSM
@ IF=0.4 A
@ IF=1.0 A
0.9
1.0
V
F
Volts
uA
Maximum instantaneous forward voltage
Maximum DC reverse current
at rated DC blocking voltage
@T
@T
C
=25oC
=150oC
5
IR
C
200
A2s
pF
I2t rating for fusing ( t < 8.3ms )
I2t
3.74
Typical junction capacitance per element (NOTE 1)
Typical thermal resistance, junction to ambient (NOTE 2)
Operating junction and storage temperature range
CJ
25
110
oC / W
oC
R
JA
TJ
,TSTG
-55 to +175
NOTES : (1) Measured at 1.0 MHz and applied reverse voltage of 4.0 V DC.
(2) Thermal resistance, junction to ambient, measured on PC board with 5.0mm (0.03mm thick) land areas.
2
Zowie Technology Corporation
05/2004