是否Rohs认证: | 不符合 | 生命周期: | Contact Manufacturer |
包装说明: | LFBGA, | Reach Compliance Code: | compliant |
ECCN代码: | 3A001.A.3 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.85 | Is Samacsys: | N |
具有ADC: | NO | 地址总线宽度: | 28 |
位大小: | 32 | 最大时钟频率: | 90 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B144 |
JESD-609代码: | e0 | 长度: | 12 mm |
I/O 线路数量: | 端子数量: | 144 | |
最高工作温度: | 70 °C | 最低工作温度: | |
PWM 通道: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.45 mm |
速度: | 90 MHz | 最大供电电压: | 3.45 V |
最小供电电压: | 3.15 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 12 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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