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MB82DBS08164C-70L PDF预览

MB82DBS08164C-70L

更新时间: 2024-09-18 04:16:47
品牌 Logo 应用领域
富士通 - FUJITSU 手机
页数 文件大小 规格书
58页 545K
描述
128 M Bit (8 M word】16 bit) Mobile Phone Application Specific Memory

MB82DBS08164C-70L 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIE,Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92最长访问时间:70 ns
JESD-30 代码:X-XUUC-N内存密度:134217728 bit
内存集成电路类型:PSEUDO STATIC RAM内存宽度:16
功能数量:1字数:8388608 words
字数代码:8000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-30 °C
组织:8MX16封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:UNSPECIFIED
封装形式:UNCASED CHIP并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED

MB82DBS08164C-70L 数据手册

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FUJITSU SEMICONDUCTOR  
DATA SHEET  
DS05-11435-1E  
MEMORY Mobile FCRAMTM  
CMOS  
128 M Bit (8 M word×16 bit)  
Mobile Phone Application Specific Memory  
MB82DBS08164C-70L  
DESCRIPTION  
The FUJITSU MB82DBS08164C is a CMOS Fast Cycle Random Access Memory (FCRAM*) with asynchronous  
Static Random Access Memory (SRAM) interface containing 134,217,728 storages accessible in a 16-bit format.  
MB82DBS08164C is utilized using a FUJITSU advanced FCRAM core technology and improved integration in  
comparison to regular SRAM.  
The MB82DBS08164C adopts asynchronous mode and synchronous burst mode for fast memory access as user  
configurable options.  
This MB82DBS08164C is suited for mobile applications such as Cellular Handset and PDA.  
* : FCRAM is a trademark of Fujitsu Limited, Japan  
FEATURES  
• Asynchronous SRAM Interface  
• COSMORAM Revision 3 Compliance  
(COSMORAM : Common Specifications of Mobile RAM)  
• Fast Access Time : tCE = 70 ns Max  
• Burst Read/Write Access Capability :  
tCK = 9.5 ns Min /104 MHz Max  
tAC = 6 ns Max  
• Low Voltage Operating Condition : VDD = 1.7 V to 1.95 V  
• Wide Operating Temperature : TA = 30 °C to + 85 °C  
Junction Temperature : TJ = − 30 °C to + 90 °C  
• Byte Control by LB and UB  
• Low-Power Consumption : IDDA1 = 40 mA Max  
IDDS1 = 300 µA Max  
• Various Power Down mode : Sleep  
16 M-bit Partial  
32 M-bit Partial  
64 M-bit Partial  
• Shipping Form : Wafer/Chip  
Copyright©2006 FUJITSU LIMITED All rights reserved  

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