生命周期: | Active | 包装说明: | FBGA, BGA48,6X8,30 |
Reach Compliance Code: | compliant | 风险等级: | 5.69 |
Is Samacsys: | N | 最长访问时间: | 60 ns |
I/O 类型: | COMMON | JESD-30 代码: | R-PBGA-B48 |
内存密度: | 16777216 bit | 内存宽度: | 16 |
端子数量: | 48 | 字数: | 1048576 words |
字数代码: | 1000000 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 组织: | 1MX16 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA48,6X8,30 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 2.5/3.3 V | 认证状态: | Not Qualified |
最大待机电流: | 0.00001 A | 子类别: | Other Memory ICs |
最大压摆率: | 0.02 mA | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.75 mm |
端子位置: | BOTTOM | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MB82D01181E-60LPBN | FUJITSU |
获取价格 |
16 Mbit (1 M word 】 16 bit) Mobile Phone Appl | |
MB82D01181E-60LWT | FUJITSU |
获取价格 |
16 Mbit (1 M word 】 16 bit) Mobile Phone Appl | |
MB82DBR08163-70 | FUJITSU |
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DRAM | |
MB82DBR08163-70A | FUJITSU |
获取价格 |
DRAM | |
MB82DBR08163-70L | FUJITSU |
获取价格 |
暂无描述 | |
MB82DBR08163A-70LWT | FUJITSU |
获取价格 |
Pseudo Static RAM, 8MX16, 70ns, CMOS, WAFER | |
MB82DBS02154E-70L | FUJITSU |
获取价格 |
32 Mbit Mobile FCRAM 1.8 V, Burst Mode, Multiplexed Address and Data Bus | |
MB82DBS02163C | FUJITSU |
获取价格 |
32 M Bit (2 M word】16 bit) Mobile Phone Appli | |
MB82DBS02163C-70L | FUJITSU |
获取价格 |
32 M Bit (2 M word】16 bit) Mobile Phone Appli | |
MB82DBS02163C-70LPBT | FUJITSU |
获取价格 |
32 M Bit (2 M word】16 bit) Mobile Phone Appli |