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48SD3208RPFK PDF预览

48SD3208RPFK

更新时间: 2024-01-21 22:35:55
品牌 Logo 应用领域
麦斯威 - MAXWELL 内存集成电路光电二极管动态存储器
页数 文件大小 规格书
39页 588K
描述
256 Mb SDRAM 8-Meg X 8-Bit X 4-Banks

48SD3208RPFK 技术参数

生命周期:Transferred零件包装代码:DFP
包装说明:DFP,针数:72
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.33
访问模式:FOUR BANK PAGE BURST最长访问时间:6 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDFP-F72
长度:26.67 mm内存密度:268435456 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:8
功能数量:1端口数量:1
端子数量:72字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:32MX8封装主体材料:PLASTIC/EPOXY
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK认证状态:Not Qualified
座面最大高度:4.1656 mm自我刷新:YES
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:0.635 mm
端子位置:DUAL宽度:19 mm
Base Number Matches:1

48SD3208RPFK 数据手册

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48SD3208  
256 Mb SDRAM  
8-Meg X 8-Bit X 4-Banks  
FEATURES:  
DESCRIPTION:  
• 256 Megabit ( 8-Meg X 8-Bit X 4-Banks)  
• RAD-PA radiation-hardened against natural space  
radiation  
Maxwell Technologies’ Synchronous Dynamic Random  
Access Memory (SDRAM) is ideally suited for space  
applications requiring high performance computing and  
high density memory storage. As microprocessors  
increase in speed and demand for higher density mem-  
ory escalates, SDRAM has proven to be the ultimate  
solution by providing bit-counts up to 256 Mega Bits and  
speeds up to 100 Megahertz. SDRAMs represent a sig-  
nificant advantage in memory technology over traditional  
SRAMs including the ability to burst data synchronously  
at high rates with automatic column-address generation,  
the ability to interleave between banks masking pre-  
charge time.  
Total Dose Hardness:  
>100 krad (Si), depending upon space mission  
• Excellent Single Event Effects:  
SEL >85 MeV/mg/cm2 @ 25°C  
TH  
• JEDEC Standard 3.3V Power Supply  
• Operating Current: 115 mA  
• Clock Frequency: 100 MHz Operation  
• Operating tremperature: -55 to +125 °C  
Auto Refresh  
• Single pulsed RAS  
• 2 Burst Sequence variations  
Sequential (BL =1/2/4/8)  
Maxwell Technologies’ patented RAD-PAK® packaging  
technology incorporates radiation shielding in the micro-  
circuit package. It eliminates the need for box shielding  
for a lifetime in orbit or space mission. In a typical GEO  
orbit, RAD-PAK® provides greater than 100 krads(Si)  
radiation dose tolerance. This product is available with  
screening up to Maxwell Technologies self-defined Class  
K.  
Interleave (BL = 1/2/4/8)  
• Programmable CAS latency: 2/3  
• Power Down and Clock Suspend Modes  
LVTTL Compatible Inputs and Outputs  
• Package: 72-Pin RAD-PAK® Flat Package  
01.10.05 Rev 2  
1
All data sheets are subject to change without notice  
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com  
©2005 Maxwell Technologies  
All rights reserved.  

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