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MAX813LMJA/883B PDF预览

MAX813LMJA/883B

更新时间: 2024-12-01 14:53:07
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
5页 24K
描述
Power Supply Management Circuit, Fixed, 1 Channel, CMOS, CDIP8, CERAMIC, DIP-8

MAX813LMJA/883B 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Active零件包装代码:DIP
包装说明:CERAMIC, DIP-8针数:8
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.12
Is Samacsys:N可调阈值:NO
模拟集成电路 - 其他类型:POWER SUPPLY MANAGEMENT CIRCUITJESD-30 代码:R-GDIP-T8
JESD-609代码:e0湿度敏感等级:1
信道数量:1功能数量:1
端子数量:8最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装等效代码:DIP8,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):245电源:5 V
认证状态:Not Qualified筛选级别:MIL-STD-883 Class B
座面最大高度:5.08 mm子类别:Power Management Circuits
最大供电电流 (Isup):0.5 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.2 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

MAX813LMJA/883B 数据手册

 浏览型号MAX813LMJA/883B的Datasheet PDF文件第2页浏览型号MAX813LMJA/883B的Datasheet PDF文件第3页浏览型号MAX813LMJA/883B的Datasheet PDF文件第4页浏览型号MAX813LMJA/883B的Datasheet PDF文件第5页 
SCOPE:  
MICROPROCESSOR SUPERVISORY CIRCUITS  
Device Type  
Generic Number  
MAX705(x)/883B  
MAX706(x)/883B  
MAX707(x)/883B  
MAX708(x)/883B  
MAX813L(x)/883B  
01  
02  
03  
04  
05  
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:  
Outline Letter  
MAXIM SMD  
Mil-Std-1835  
Case Outline  
Package Code  
JA  
LP  
P
2
GDIP1-T08 or CDIP2-T08  
CQCC1-N20  
8 LEAD CERDIP  
20 Pin Leadless Chip  
J08  
L20  
Absolute Maximum Ratings  
Terminal Voltage (with respect to GND)  
VCC .................................................................................................................. -0.3V to +6.0V  
All other Inputs 1/ .................................................................................. -0.3V to (Vcc+0.3V)  
Input Current  
VCC ................................................................................................................................. 10mA  
GND ............................................................................................................................... 10mA  
Output Current (all outputs) ............................................................................................... 10mA  
Lead Temperature (soldering, 10 seconds) ...................................................................... +300°C  
Storage Temperature ......................................................................................... -65°C to +160°C  
Continuous Power Dissipation ................................................................................... TA=+70°C  
8 lead CERDIP(derate 8.0mW/°C above +70°C) ...................................................... 640mW  
20 lead LCC(derate 9.1mW/°C above +70°C) .......................................................... 727mW  
Junction Temperature TJ ............................................................................................. +150°C  
Thermal Resistance, Junction to Case, ΘJC:  
Case Outline 8 lead CERDIP........................................................................ 55°C/W  
Case Outline 20 leadless Chip carrier .......................................................... 20°C/W  
Thermal Resistance, Junction to Ambient, ΘJA:  
Case Outline 8 lead CERDIP...................................................................... 125°C/W  
Case Outline 20 leadless Chip carrier ........................................................ 110°C/W  
Recommended Operating Conditions  
Ambient Operating Range (TA) ............................................................... -55°C to +125°C  
Supply Voltage Range (VCC) ...................................................................... +1.2V to +5.5V  
___  
NOTE 1: The input voltage limits on PFI and MR may be exceeded if the input current is less than 10mA.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
----------------------------  
Electrical Characteristics of MAX705/706/707/708/813L/883B 19-0216  
for /883B and SMD 5962-93267 Page 2 of  
Rev. C  
7

MAX813LMJA/883B 替代型号

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