是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | MICRO, SOP-8 |
针数: | 8 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.62 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-PDSO-G8 | JESD-609代码: | e0 |
长度: | 3 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 245 | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | AUTOMOTIVE | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | Base Number Matches: | 1 |
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