是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | MODULE | 包装说明: | ROHS COMPLIANT, PLASTIC PACKAGE |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.84 |
JESD-30 代码: | X-PXSS-X | 内存密度: | 1024 bit |
内存集成电路类型: | MEMORY CIRCUIT | 内存宽度: | 1 |
功能数量: | 1 | 字数: | 1024 words |
字数代码: | 1000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 50 °C | 最低工作温度: | -25 °C |
组织: | 1KX1 | 封装主体材料: | PLASTIC/EPOXY |
封装形状: | UNSPECIFIED | 封装形式: | SPECIAL SHAPE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 表面贴装: | NO |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | UNSPECIFIED | 端子位置: | UNSPECIFIED |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | Base Number Matches: | 1 |
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