是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | HVSON, SOLCC8,.12,25 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 0.71 | Is Samacsys: | N |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-XDSO-N8 |
JESD-609代码: | e3 | 长度: | 3 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVSON | 封装等效代码: | SOLCC8,.12,25 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 2.7/24 V |
认证状态: | Not Qualified | 座面最大高度: | 0.8 mm |
子类别: | Other Analog ICs | 最大供电电流 (Isup): | 0.25 mA |
最大供电电压 (Vsup): | 24 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 12 V | 表面贴装: | YES |
技术: | BICMOS | 温度等级: | AUTOMOTIVE |
端子面层: | Matte Tin (Sn) | 端子形式: | NO LEAD |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 3 mm |
Base Number Matches: | 1 |
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