是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SSOP, SSOP16,.25 | 针数: | 16 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 1.7 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 712859 |
Samacsys Pin Count: | 16 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | QSOP_16 |
Samacsys Released Date: | 2020-01-15 12:50:31 | Is Samacsys: | N |
模拟集成电路 - 其他类型: | DIFFERENTIAL MULTIPLEXER | JESD-30 代码: | R-PDSO-G16 |
JESD-609代码: | e3 | 长度: | 4.89 mm |
湿度敏感等级: | 1 | 负电源电压最大值(Vsup): | -8 V |
负电源电压最小值(Vsup): | -3 V | 标称负供电电压 (Vsup): | -5 V |
信道数量: | 4 | 功能数量: | 2 |
端子数量: | 16 | 标称断态隔离度: | 75 dB |
通态电阻匹配规范: | 6 Ω | 最大通态电阻 (Ron): | 100 Ω |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SSOP |
封装等效代码: | SSOP16,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | +-3/+-8/3/15 V | 认证状态: | Not Qualified |
座面最大高度: | 1.73 mm | 最大信号电流: | 0.03 A |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.001 mA |
最大供电电压 (Vsup): | 8 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
最长断开时间: | 150 ns | 最长接通时间: | 150 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.635 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3.9 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
DG212CSE-T | MAXIM |
完全替代 |
SPST, 4 Func, 1 Channel, CMOS, PDSO16, 0.150 INCH, MS-012AC, SOIC-16 | |
MAX358CPE+ | MAXIM |
功能相似 |
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暂无描述 | |
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Use this 40 A MAXITM fuse as a replacement fo |