是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | DIP, DIP16,.3 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.92 | JESD-30 代码: | R-XDIP-T16 |
JESD-609代码: | e0 | 标称负供电电压 (Vsup): | -15 V |
信道数量: | 8 | 功能数量: | 1 |
端子数量: | 16 | 最大通态电阻 (Ron): | 1800 Ω |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | CERAMIC | 封装代码: | DIP |
封装等效代码: | DIP16,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 电源: | +-15 V |
认证状态: | Not Qualified | 最大信号电流: | 0.02 A |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.7 mA |
标称供电电压 (Vsup): | 15 V | 表面贴装: | NO |
最长接通时间: | 500 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
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