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SLLS569B − MAY 2003 − REVISED APRIL 2008
DB OR PW PACKAGE
(TOP VIEW)
D
Qualified for Automotive Applications
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
1
C2+
C1+
V+
28
27
26
25
2
GND
C2−
V−
D
Meets or Exceeds Requirements of
TIA/EIA-232-F and ITU v.28 Standards
3
V
CC
4
C1−
5
DOUT1
DOUT2
DOUT3
RIN1
24 DIN1
23 DIN2
D
D
D
D
D
D
D
Operates With 3-V to 5.5-V V
Supply
CC
6
Operates Up To 250 kbit/s
7
22
21
20
19
18
17
16
15
DIN3
Five Drivers and Three Receivers
8
ROUT1
ROUT2
DIN4
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
9
RIN2
10
11
12
13
14
DOUT4
RIN3
ROUT3
DIN5
DOUT5
Always-Active Noninverting Receiver
Output (ROUT1B)
FORCEON
FORCEOFF
ROUT1B
INVALID
D
RS-232 Bus-Pin ESD Protection Exceeds
15 kV Using Human-Body Model (HBM)
description/ordering information
The MAX3238 consists of five line drivers, three line receivers, and a dual charge-pump circuit with 15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer
applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows
applications using the ring indicator to transmit data while the device is powered down. These devices operate
at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
{
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
SSOP (DB)
Tape and reel
Tape and reel
MAX3238IDBRQ1
MAX3238IPWRQ1
MAX3238Q
MB3238Q
−40°C to 85°C
TSSOP (PW)
†
‡
For the most current package and ordering information, see the Package Option Addendum at
the end of this document, or see the TI web site at http://www.ti.com.
Package
drawings,
thermal
data,
and
symbolization
are
available
at
http://www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2008, Texas Instruments Incorporated
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