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Datasheet > 驱动程序和接口 > 线路驱动器或接收器> MAX3237EIDWG4
MAX3237EIDWG4 PDF预览

MAX3237EIDWG4

更新时间： 2024-10-31 05:00:23
品牌 Logo 应用领域
德州仪器 - TI 线路驱动器或接收器驱动程序和接口接口集成电路光电二极管
页数 文件大小 规格书
15页 233K
描述
3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER

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中文翻译

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MAX3237EIDWG4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SOIC
包装说明：SOP, SOP28,.4针数：28
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.52
其他特性：ALSO OPERATES AT 5V SUPPLY差分输出：NO
驱动器位数：5高电平输入电流最大值：0.000001 A
输入特性：SCHMITT TRIGGER接口集成电路类型：LINE TRANSCEIVER
接口标准：EIA-232-F; TIA-232-F; V.28JESD-30 代码：R-PDSO-G28
JESD-609代码：e4长度：17.9 mm
湿度敏感等级：1功能数量：3
端子数量：28最高工作温度：85 °C
最低工作温度：-40 °C最小输出摆幅：10 V
最大输出低电流：0.001 A封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装等效代码：SOP28,.4
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260电源：3.3/5 V
认证状态：Not Qualified最大接收延迟：150 ns
接收器位数：3座面最大高度：2.65 mm
子类别：Line Driver or Receivers最大压摆率：2 mA
最大供电电压：3.6 V最小供电电压：3 V
标称供电电压：3.3 V表面贴装：YES
温度等级：INDUSTRIAL端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：1.27 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：7.5 mmBase Number Matches：1

MAX3237EIDWG4 数据手册

 浏览型号MAX3237EIDWG4的Datasheet PDF文件第2页浏览型号MAX3237EIDWG4的Datasheet PDF文件第3页浏览型号MAX3237EIDWG4的Datasheet PDF文件第4页浏览型号MAX3237EIDWG4的Datasheet PDF文件第5页浏览型号MAX3237EIDWG4的Datasheet PDF文件第6页浏览型号MAX3237EIDWG4的Datasheet PDF文件第7页 
MAX3237E  
3-V TO 5.5-V MULTICHANNEL RS-232  
1-MBit/s LINE DRIVER/RECEIVER  
www.ti.com  
SLLS709A–MAY 2006–REVISED OCTOBER 2006  
FEATURES  
•
Meets or Exceeds the Requirements of  
TIA/EIA-232-F and ITU v.28 Standards  
•
ESD Protection for RS-232 I/O Pins and Logic  
Input pins  
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply  
Operates From 250 kbits/s to 1 Mbit/s  
Low Standby Current . . . 1 µA Typical  
External Capacitors . . . 4 × 0.1 µF  
– ±15 kV – Human-Body Model (HBM)  
– ±8 kV – IEC61000-4-2, Contact Discharge  
– ±15 kV – IEC61000-4-2, Air-Gap Discharge  
APPLICATIONS  
Accepts 5-V Logic Input With 3.3-V Supply  
•
Battery-Powered, Hand-Held, and Portable  
Equipment  
PDAs and Palmtop PCs  
Notebooks, Sub-Notebooks, and Laptops  
Digital Cameras  
Designed to Be Interchangeable With Maxim  
MAX3237E  
•
•
•
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Mobile Phones and Wireless Devices  
DB, DW, OR PW PACKAGE  
(TOP VIEW)  
QFN PACKAGE  
(TOP VIEW)  
C2+  
GND  
C2−  
C1+  
V+  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
2
V
CC  
3
32 31 30 29 28 27 26 25  
V−  
C1−  
DIN1  
4
DOUT1  
DOUT2  
DOUT3  
RIN1  
RIN2  
DOUT4  
RIN3  
C1–  
DIN1  
IN2  
DIN3  
ROUT1  
ROUT2  
DIN4  
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
DOUT1  
DOUT2  
DOUT3  
RIN1  
5
DIN2  
6
DIN3  
7
ROUT1  
ROUT2  
DIN4  
8
RIN2  
DOUT4  
RIN3  
9
10  
11  
12  
ROUT3  
ROUT3  
DIN5  
NC  
DOUT5  
9 10 11 12 13 14 15 16  
EN 13  
14  
16 ROUT1B  
15  
SHDN  
MBAUD  
DESCRIPTION  
The MAX3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV  
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of  
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the  
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to  
5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode  
(MBAUD = GND) and 1Mbit/s when MBAUD = VCC. The driver output slew rate is a maximum of 30 V/µs.  
DESCRIPTION (CONTINUED)  
The MAX3237E transmitters are disabled and the outputs are forced into high-impedance state when the device  
is in shutdown mode (SHDN = GND) and the supply current falls to less than 1 µA. Also, during shutdown, the  
onboard charge pump is disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also  
can be placed in the high-impedance state by setting enable (EN) high. ROUT1B remains active all the time,  
regardless of the EN and SHDN condition.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...15

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