MAX3232
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
SLLS410B – JANUARY 2000 – REVISED MARCH 2000
D, DB, DW, OR PW PACKAGE
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
(TOP VIEW)
Operates With 3-V to 5.5-V V
Operates up to 250 kbit/s
Supply
CC
C1+
V+
V
CC
15 GND
1
2
3
4
5
6
7
8
16
Low Supply Current . . . 300 µA Typical
External Capacitors . . . 4 × 0.1 µF
14
13
12
11
10
9
C1–
DOUT1
RIN1
C2+
C2–
ROUT1
DIN1
Accepts 5-V Logic Input With 3.3-V Supply
V–
Designed to Be Interchangeable With
Maxim MAX3232
DOUT2
RIN2
DIN2
ROUT2
RS-232 Bus-Pin ESD Protection Exceeds
±15-kV Using Human-Body Model (HBM)
Applications
– Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages
description
The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with
±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation
from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum
of 30-V/µs driver output slew rate.
The MAX3232C is characterized for operation from 0°C to 70°C. The MAX3232I is characterized for operation
from –40°C to 85°C.
AVAILABLE OPTIONS
PACKAGED DEVICES
SHRINK
SMALL OUTLINE
(DB)
THIN SHRINK
SMALL OUTLINE
(PW)
T
A
SMALL OUTLINE
(D)
SMALL OUTLINE
(DW)
0°C to 70°C
MAX3232CDB
MAX3232IDB
MAX3232CDGV
MAX3232IDGV
MAX3232CDW
MAX3232IDW
MAX3232CPW
MAX3232IPW
–40°C to 85°C
The D, DB, DW, and PW packages are available taped and reeled. Add the suffix R to device type (e.g.,
MAX3232CDR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2000, Texas Instruments Incorporated
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265