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SLLS409K − JANUARY 2000 − REVISED MARCH 2004
DB, DW, OR PW PACKAGE
(TOP VIEW)
D
RS-232 Bus-Pin ESD Protection Exceeds
15 kV Using Human-Body Model (HBM)
D
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
1
2
3
4
5
6
7
8
9
10
20
19
18
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15
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13
12
11
EN
C1+
V+
C1−
C2+
FORCEOFF
V
CC
D
D
D
D
D
D
D
Operates With 3-V to 5.5-V V Supply
CC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
Operates Up To 250 kbit/s
Two Drivers and Two Receivers
C2−
V−
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
DOUT2
RIN2
ROUT2
Accepts 5-V Logic Input With 3.3-V Supply
DIN2
INVALID
Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3223
D
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The MAX3223 consists of two line drivers, two line receivers, and a dual charge-pump circuit with 15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. The charge pump and four small external capacitors allow operation from a single
3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs
driver output slew rate.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
Tube of 25
Reel of 2000
Tube of 70
Reel of 2000
Tube of 70
Reel of 2000
Tube of 25
Reel of 2000
Tube of 70
Reel of 2000
Tube of 70
Reel of 2000
MAX3223CDW
MAX3223CDWR
MAX3223CDB
MAX3223CDBR
MAX3223CPW
MAX3223CPWR
MAX3223IDW
MAX3223IDWR
MAX3223IDB
SOIC (DW)
SSOP (DB)
TSSOP (PW)
SOIC (DW)
SSOP (DB)
TSSOP (PW)
MAX3223C
MA3223C
MA3223C
MAX3223I
MB3223I
−0°C to 70°C
−40°C to 85°C
MAX3223IDBR
MAX3223IPW
MAX3223IPWR
MB3223I
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
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