是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | DIE |
包装说明: | DIE-16 | 针数: | 16 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.32 |
Is Samacsys: | N | 模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码: | R-XUUC-N16 | JESD-609代码: | e0 |
湿度敏感等级: | 1 | 负电源电压最大值(Vsup): | -20 V |
负电源电压最小值(Vsup): | -4.5 V | 标称负供电电压 (Vsup): | -15 V |
信道数量: | 8 | 功能数量: | 1 |
端子数量: | 16 | 标称断态隔离度: | 75 dB |
通态电阻匹配规范: | 1.5 Ω | 最大通态电阻 (Ron): | 100 Ω |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | UNSPECIFIED | 封装代码: | DIE |
封装形状: | RECTANGULAR | 封装形式: | UNCASED CHIP |
峰值回流温度(摄氏度): | 240 | 认证状态: | Not Qualified |
最大供电电压 (Vsup): | 20 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 15 V | 表面贴装: | YES |
最长断开时间: | 150 ns | 最长接通时间: | 150 ns |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | NO LEAD |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
DG508AC/D | MAXIM |
完全替代 |
Monolithic CMOS Analog Multiplexers | |
MAX358C/D | MAXIM |
功能相似 |
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