是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, | 针数: | 4 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | 风险等级: | 2.11 |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-PBGA-B4 |
JESD-609代码: | e1 | 长度: | 0.84 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 4 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
座面最大高度: | 0.69 mm | 最大供电电压 (Vsup): | 3.3 V |
最小供电电压 (Vsup): | 1.6 V | 标称供电电压 (Vsup): | 2.85 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 0.84 mm | Base Number Matches: | 1 |
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