是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 2.10 X 2.70 MM, UCSP-20 |
针数: | 20 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.92 |
Is Samacsys: | N | JESD-30 代码: | R-PBGA-B20 |
JESD-609代码: | e0 | 长度: | 2.64 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 20 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 240 |
认证状态: | Not Qualified | 座面最大高度: | 0.67 mm |
标称供电电压: | 2.75 V | 表面贴装: | YES |
电信集成电路类型: | RF AND BASEBAND CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn63Pb37) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 2.02 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX2386EVKIT | MAXIM |
获取价格 |
Evaluation Kit for the MAX2385/MAX2386 | |
MAX2387 | MAXIM |
获取价格 |
W-CDMA LNA/Mixer ICs | |
MAX2387EGC | ROCHESTER |
获取价格 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC12, 3 X 3 MM, 0.90 MM HEIGHT, QFN-12 | |
MAX2387EGC | MAXIM |
获取价格 |
RF and Baseband Circuit, 3 X 3 MM, 0.90 MM HEIGHT, QFN-12 | |
MAX2387EGC+T | MAXIM |
获取价格 |
RF and Baseband Circuit, 3 X 3 MM, ULTRA SMALL, QFN-12 | |
MAX2387EVKIT | MAXIM |
获取价格 |
Evaluation Kit for the MAX2387/MAX2388/MAX2389 | |
MAX2388 | MAXIM |
获取价格 |
W-CDMA LNA/Mixer ICs | |
MAX2388EGC | ROCHESTER |
获取价格 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC12, 3 X 3 MM, 0.90 MM HEIGHT, QFN-12 | |
MAX2388EGC | MAXIM |
获取价格 |
RF and Baseband Circuit, 3 X 3 MM, 0.90 MM HEIGHT, QFN-12 | |
MAX2388EGC+ | MAXIM |
获取价格 |
暂无描述 |