19-2108; Rev 0; 7/01
W-CDMA Upconverter and PA Driver
with Power Control
General Description
Features
The MAX2383 upconverter and PA driver IC
is designed for emerging ARIB (Japan) and
ETSI-UMTS (Europe) W-CDMA applications. The IC
includes an upconversion mixer with variable gain con-
trol, an LO buffer, and a variable-gain PA driver for out-
put power control.
o +6dBm Output Power with -46dBc ACPR
o Ultra-Miniature UCSP Package
o Upconverter Gain-Control Range: 35dB
o Automatic Dynamic Current Control
o 12mA Quiescent Supply Current
o On-Chip LO Buffer with Disable
The MAX2383 is designed to support the IMT-2000
frequency band. It includes a differential IF input port,
an LO input port, and PA driver input/output ports. The
upconverter mixer incorporates an AGC with over 30dB
of gain control. The IC provides automatic throttle-back
of PA driver and mixer current as output power is
reduced. The main signal path and the LO buffer can
be shutdown independently. The on-chip LO buffer can
be kept ON while the main transmitter path is being
turned on and off to minimize VCO pulling during TX
gated-transmission.
o Low Out-of-Band Noise Power in RX Band:
≤ -144dBm/Hz at +6dBm P
OUT
o No Interstage TX SAW Bandpass Filter Required
Ordering Information
The MAX2383 is specified for +2.7V to +3.0V single
supply and is housed in an ultra-miniature 3 x 4
UCSP™ package for optimum cost- and space-reduc-
tion and for best RF performance. The IC is targeted for
the 2270MHz to 2580MHz LO frequency range. It is
fabricated using an advanced high-frequency bipolar
process. The mixer and PA driver linearity have been
optimized to provide excellent RF performance in the
1920MHz to 1980MHz band, while drawing minimal
current. The mixer’s performance is optimized for a
-10dBm 3dB LO drive at the LO buffer input port. The
LO port can be configured to be driven either single-
ended or differentially.
PART
TEMP. RANGE
PIN-PACKAGE
MAX2383EBC
-40°C to +85°C
3 x 4 UCSP
ACTUAL SIZE
UCSP
✕
2mm 1.5mm
The MAX2383 achieves excellent noise and image sup-
pression without the use of an interstage TX SAW band-
pass filter, thereby saving valuable board space, cost,
and supply current.
Block Diagram
TOP VIEW
For LNA and downconverter mixer companion ICs, see
the MAX2387/MAX2388/MAX2389 data sheet.
V
A2
DROUT
A3
GND
A4
CC
LO+ /
LO_EN
A1
Applications
PA
DRVR
Japanese 3G Cellular Phones (ARIB)
European 3G Cellular Phones (UMTS)
Chinese 3G Cellular Phones (TD-SCDMA)
PCS Phones
MAX2383
GC B3
B4
DRIN
LO-/
SHDN
B1
C1
C2
IF
C3
RF
C4
Pin Configuration appears at end of data sheet.
IF
IN-
GND
IN+
OUT
Typical Operating Circuit appears at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.