是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | QFN |
包装说明: | HVQCCN, | 针数: | 56 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 17 weeks |
风险等级: | 5.55 | Is Samacsys: | N |
其他特性: | ALSO OPERATES ON 4.75V SUPPLY | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-XQCC-N56 | JESD-609代码: | e3 |
长度: | 8 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 56 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 最大供电电压 (Vsup): | 3.47 V |
最小供电电压 (Vsup): | 3.13 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 8 mm | Base Number Matches: | 1 |
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