Attenuator DIE
DC - 20 GHz
MAT10xxx Series
Rev. V5
Features
•
•
•
Medium Power Handling 2 W CW
Flat Response from DC to 20 GHz
Return Loss:
>18 dB DC to 12 GHz
>16 dB 13 to 20 GHz
•
•
•
•
Space Saving Footprint:
0.030” x 0.030” (0.762 x 0.762 mm)
Very Good Stability Over Temperature
(TRC <100 PPM)
Ground Wrap to Top
(No ground bonding required)
RoHS* Compliant
Front to back metallization in 4 places
Description
These fixed attenuator chips are fabricated using our
state of the art thin film metallization and advanced
photolithography technology.
All devices are available in chip form with a
metalized ground connection on the back. This
ground is wrapped around on the four corners of the
chip so additional ground bonding ribbon is not
required.
Bonding pad sizes and resistor outline
may differ from value to value.
The chips may be attached using conductive epoxy
or solder preform. Gold contacts on the input and
output pads make assembly, using standard
bonding equipment, fast and reliable. Custom values
and configuration available on request.
Electrical Specifications: TA = +25°C
Part Number
MAT10000
MAT10010
MAT10020
MAT10030
MAT10040
MAT10050
MAT10060
MAT10070
MAT10080
Attenuation (dB)
Insertion Loss (dB)
Return Loss (dB)
0
1
2
3
4
5
6
7
8
+/-0.30
+/-0.30
+/-0.30
+/-0.30
+/-0.30
+/-0.30
+/-0.35
+/-0.35
+/-0.35
>18
>18
>18
>18
>18
>18
>18
>18
>18
CONTINUED
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0011352