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MASW-001150-1316 PDF预览

MASW-001150-1316

更新时间: 2024-11-06 14:55:35
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MACOM /
页数 文件大小 规格书
9页 202K
描述
HMIC PIN Diode,50W

MASW-001150-1316 数据手册

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MASW-001150-1316  
SURMOUNT PIN Diode Switch Element  
with Thermal Terminal  
V5  
Features  
 Specified Bandwidth: 45MHz—2.5GHz  
 Useable 30MHz to 3.0GHz  
 Low Loss <0.5dB  
 High isolation >40dB  
 High C.W. Incident Power, 50W at 500MHz  
 High Input IP3, +66dBm @ 500MHz  
 Unique Thermal Terminal for Series Diode  
 Surface Mount Device (No Wire Bonds)  
 Rugged Silicon-Glass Construction  
 Silicon Nitride Passivation Protective Polymer  
 Protective Polymer Scratch Protection  
 RoHS Compliant  
Description  
A PIN diode series-shunt switch element with a unique  
integrated thermal terminal for dissipating heat in the  
series diode created by the DC and RF input power.  
The thermal terminal allows for optimum heat dissipa-  
tion by providing a direct thermal connection between  
the series diode and the circuit heatsink while also  
being electrically isolated. The chip is designed to pro-  
vide a heat transfer conduit that does not interfere with  
the PIN diode anode (input) and cathode (output) elec-  
Ordering Information 2  
Part Number  
trical terminals, especially with respect to RF  
per-  
Package  
formance. The chip is fabricated using M/A-COM  
Technology Solutions patented HMIC™ process and  
MASW-001150-13160W  
WAFFLE PACK  
features silicon  
pedestals embedded in a low loss,  
MASW-001150-13160P  
POCKET TAPE  
low dispersion glass for low leakage current. The top-  
side is fully encapsulated with silicon nitride and has  
an additional polymer layer to protect against damage  
during handling and assembly.  
2. Reference Application Note M513 for reel size information.  
Absolute Maximum Ratings  
Parameter  
Absolute Maximum  
Applications  
Forward Current  
100mA  
- 180V  
This PIN diode series-shunt switch element is  
particularly advantageous in high average power,  
50W, switch applications from 30MHZ – 3GHz. The  
backside RF, D.C., and thermal I/O ports allow for  
direct solder re-flow, surface mount, attachment to a  
micro-strip circuit assembly. The thermal terminal  
design provides the, power dissipating, series diode a  
direct connection to the circuit thermal ground for  
unprecedented heat transfer. The thermal terminal  
port is electrically isolated from the I/O ports and can  
be configured as either a reflective or an absorptive  
switch.  
Reverse Voltage  
Operating Temperature  
Storage Temperature  
Junction Temperature  
Dissipated RF & DC Power  
RF C.W. Incident Power  
Mounting Temperature  
-55°C to +125°C  
-55°C to +150°C  
+175°C  
500MHz, 4W  
500MHz, 50W  
+260°C for 30 seconds  
Class 1A — HBM  
Class M3 — MM  
ESD  
ESD  
ESD  
Class C3 — CDM  
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  

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