MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
Features
Specified Bandwidth: 45MHz—2.5GHz
Useable 30MHz to 3.0GHz
Low Loss <0.5dB
High isolation >40dB
High C.W. Incident Power, 50W at 500MHz
High Input IP3, +66dBm @ 500MHz
Unique Thermal Terminal for Series Diode
Surface Mount Device (No Wire Bonds)
Rugged Silicon-Glass Construction
Silicon Nitride Passivation Protective Polymer
Protective Polymer Scratch Protection
RoHS Compliant
Description
A PIN diode series-shunt switch element with a unique
integrated thermal terminal for dissipating heat in the
series diode created by the DC and RF input power.
The thermal terminal allows for optimum heat dissipa-
tion by providing a direct thermal connection between
the series diode and the circuit heatsink while also
being electrically isolated. The chip is designed to pro-
vide a heat transfer conduit that does not interfere with
the PIN diode anode (input) and cathode (output) elec-
Ordering Information 2
Part Number
trical terminals, especially with respect to RF
per-
Package
formance. The chip is fabricated using M/A-COM
Technology Solutions patented HMIC™ process and
MASW-001150-13160W
WAFFLE PACK
features silicon
pedestals embedded in a low loss,
MASW-001150-13160P
POCKET TAPE
low dispersion glass for low leakage current. The top-
side is fully encapsulated with silicon nitride and has
an additional polymer layer to protect against damage
during handling and assembly.
2. Reference Application Note M513 for reel size information.
Absolute Maximum Ratings
Parameter
Absolute Maximum
Applications
Forward Current
100mA
- 180V
This PIN diode series-shunt switch element is
particularly advantageous in high average power,
50W, switch applications from 30MHZ – 3GHz. The
backside RF, D.C., and thermal I/O ports allow for
direct solder re-flow, surface mount, attachment to a
micro-strip circuit assembly. The thermal terminal
design provides the, power dissipating, series diode a
direct connection to the circuit thermal ground for
unprecedented heat transfer. The thermal terminal
port is electrically isolated from the I/O ports and can
be configured as either a reflective or an absorptive
switch.
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated RF & DC Power
RF C.W. Incident Power
Mounting Temperature
-55°C to +125°C
-55°C to +150°C
+175°C
500MHz, 4W
500MHz, 50W
+260°C for 30 seconds
Class 1A — HBM
Class M3 — MM
ESD
ESD
ESD
Class C3 — CDM
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.